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Electroluminescent cooling using double diode structures

  • Toufik Sadi
  • , Ivan Radevici
  • , Pyry Kivisaari
  • , Alberto Casado
  • , Jani Oksanen
  • Aalto University

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

The progress in optical cooling in recent years is resulting in a renewed interest in electroluminescent (EL) cooling using conventional III-V semiconductor light emitting diodes (LEDs). In this work, we address the limiting factors for observing EL cooling in III-As intracavity double diode structures (DDSs), at high powers at and close to 300K, by using a combination of experimental characterization and physical device models. The studied DDSs incorporate optically-coupled III-As LED and p-n homojunction photodiode (PD) structures, integrated in a single device and providing a favourable environment for EL cooling observation. We employ a modelling framework coupling the drift-diffusion charge transport model to a photon transport model calibrated using measurements on real devices at different temperatures. Results suggest that the bulk properties of the III-V materials are already sufficient for EL cooling.

Original languageEnglish
Title of host publication18th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2018
EditorsJoachim Piprek, Aleksandra B. Djurisic
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages125-126
Number of pages2
ISBN (Electronic)9781538655993
DOIs
Publication statusPublished - 7 Dec 2018
MoE publication typeA4 Article in a conference publication
Event18th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2018 - Hong Kong, China
Duration: 5 Nov 20189 Nov 2018

Conference

Conference18th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2018
Country/TerritoryChina
CityHong Kong
Period5/11/189/11/18

Funding

We acknowledge funding from the Academy of Finland and the European Research Council under the Horizon 2020 programme (grant agreement No 638173).

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