Electromechanical stability of capacitive transducers

Aarne Oja; Jukka Kyynäräinen; Heikki Seppä

doi:10.1117/12.425379

Electromechanical stability of capacitive transducers

Aarne Oja
, Jukka Kyynäräinen
, Heikki Seppä

VTT (former employee or external)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

2 Citations (Scopus)

Original language	English
Title of host publication	Design, Test, Integration and Packaging of MEMS/MOEMS 2001
Subtitle of host publication	Cannes, France, 25-27 July 2001
Publisher	International Society for Optics and Photonics SPIE
Pages	463-468
DOIs	https://doi.org/10.1117/12.425379
Publication status	Published - 2001
MoE publication type	B3 Non-refereed article in conference proceedings

Publication series

Series	Proceedings of SPIE
Volume	4408
ISSN	0277-786X

Access to Document

10.1117/12.425379

Cite this

@inproceedings{e60c217cc2144ea9910ed6a78f321183,

title = "Electromechanical stability of capacitive transducers",

author = "Aarne Oja and Jukka Kyyn{\"a}r{\"a}inen and Heikki Sepp{\"a}",

year = "2001",

doi = "10.1117/12.425379",

language = "English",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "463--468",

booktitle = "Design, Test, Integration and Packaging of MEMS/MOEMS 2001",

address = "United States",

}

Electromechanical stability of capacitive transducers. / Oja, Aarne; Kyynäräinen, Jukka; Seppä, Heikki.
Design, Test, Integration and Packaging of MEMS/MOEMS 2001: Cannes, France, 25-27 July 2001. International Society for Optics and Photonics SPIE, 2001. p. 463-468 (Proceedings of SPIE, Vol. 4408).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - Electromechanical stability of capacitive transducers

AU - Oja, Aarne

AU - Kyynäräinen, Jukka

AU - Seppä, Heikki

PY - 2001

Y1 - 2001

U2 - 10.1117/12.425379

DO - 10.1117/12.425379

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

SP - 463

EP - 468

BT - Design, Test, Integration and Packaging of MEMS/MOEMS 2001

PB - International Society for Optics and Photonics SPIE

ER -