Electromigration resistance of multilayer aluminum/titanium interconnects

Manuela Finetti, Hannu Ronkainen, Martti Blomberg, Ilkka Suni

    Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

    Original languageEnglish
    Title of host publicationThin films
    Subtitle of host publicationinterfaces and phenomena
    EditorsR.J. Nemanich, P.S. Ho, S.S. Lau
    Place of PublicationCambridge
    PublisherCambridge University Press
    Pages811-816
    ISBN (Print)978-1-1074-0574-5
    Publication statusPublished - 1986
    MoE publication typeD2 Article in professional manuals or guides or professional information systems or text book material

    Publication series

    SeriesMaterials Research Society Symposia Proceedings
    Volume54
    ISSN0272-9172

    Cite this

    Finetti, M., Ronkainen, H., Blomberg, M., & Suni, I. (1986). Electromigration resistance of multilayer aluminum/titanium interconnects. In R. J. Nemanich, P. S. Ho, & S. S. Lau (Eds.), Thin films: interfaces and phenomena (pp. 811-816). Cambridge University Press. Materials Research Society Symposia Proceedings, Vol.. 54