Electronic cooling of a submicron-sized metallic beam

J.T. Muhonen (Corresponding Author), Antti Niskanen, M. Meschke, Yu.A. Pashkin, J.S. Tsai, L. Sainiemi, S. Franssila, J.P. Pekola

Research output: Contribution to journalArticleScientificpeer-review

21 Citations (Scopus)


We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.
Original languageEnglish
Article number073101
Number of pages3
JournalApplied Physics Letters
Issue number7
Publication statusPublished - 2009
MoE publication typeA1 Journal article-refereed


  • electronic cooling
  • gold
  • palladium
  • superconductor-insulator
  • superconducting junction devices


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