Electronic cooling of a submicron-sized metallic beam

J.T. Muhonen (Corresponding Author), Antti Niskanen, M. Meschke, Yu.A. Pashkin, J.S. Tsai, L. Sainiemi, S. Franssila, J.P. Pekola

Research output: Contribution to journalArticleScientificpeer-review

17 Citations (Scopus)

Abstract

We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.
Original languageEnglish
Article number073101
Number of pages3
JournalApplied Physics Letters
Volume94
Issue number7
DOIs
Publication statusPublished - 2009
MoE publication typeA1 Journal article-refereed

Keywords

  • electronic cooling
  • gold
  • palladium
  • superconductor-insulator
  • superconducting junction devices

Fingerprint Dive into the research topics of 'Electronic cooling of a submicron-sized metallic beam'. Together they form a unique fingerprint.

Cite this