Electronic cooling of a submicron-sized metallic beam

J.T. Muhonen (Corresponding Author), Antti Niskanen, M. Meschke, Yu.A. Pashkin, J.S. Tsai, L. Sainiemi, S. Franssila, J.P. Pekola

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We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.
Original languageEnglish
Article number073101
Number of pages3
JournalApplied Physics Letters
Issue number7
Publication statusPublished - 2009
MoE publication typeA1 Journal article-refereed



  • electronic cooling
  • gold
  • palladium
  • superconductor-insulator
  • superconducting junction devices

Cite this

Muhonen, J. T., Niskanen, A., Meschke, M., Pashkin, Y. A., Tsai, J. S., Sainiemi, L., Franssila, S., & Pekola, J. P. (2009). Electronic cooling of a submicron-sized metallic beam. Applied Physics Letters, 94(7), [073101]. https://doi.org/10.1063/1.3080668