Electroplated solder alloys for flip chip interconnections

Päivi Annala, Jyrki Kaitila, Jaakko Salonen

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

    Fingerprint

    Dive into the research topics of 'Electroplated solder alloys for flip chip interconnections'. Together they form a unique fingerprint.

    Keyphrases

    INIS

    Engineering