Electroplated solder bumps for flip chip

Jyrki Kaitila, Päivi Majander, Jaakko Salonen, Ilkka Suni

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationISHM-Nordic 33rd Conference
    Subtitle of host publicationProceedings
    Place of PublicationHelsingør
    Pages98-103
    Publication statusPublished - 1996
    MoE publication typeB3 Non-refereed article in conference proceedings
    Event33rd ISHM-Nordic conference - Helsingør, Denmark
    Duration: 22 Sep 199625 Sep 1996

    Conference

    Conference33rd ISHM-Nordic conference
    CountryDenmark
    CityHelsingør
    Period22/09/9625/09/96

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