Electroplated solder bumps for flip chip

Jyrki Kaitila, Päivi Majander, Jaakko Salonen, Ilkka Suni

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationISHM-Nordic 33rd Conference
Subtitle of host publicationProceedings
Place of PublicationHelsingør
Pages98-103
Publication statusPublished - 1996
MoE publication typeB3 Non-refereed article in conference proceedings
Event33rd ISHM-Nordic conference - Helsingør, Denmark
Duration: 22 Sep 199625 Sep 1996

Conference

Conference33rd ISHM-Nordic conference
CountryDenmark
CityHelsingør
Period22/09/9625/09/96

Cite this

Kaitila, J., Majander, P., Salonen, J., & Suni, I. (1996). Electroplated solder bumps for flip chip. In ISHM-Nordic 33rd Conference: Proceedings (pp. 98-103).