Electroplated solder bumps for flip chip

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	ISHM-Nordic 33rd Conference
Subtitle of host publication	Proceedings
Place of Publication	Helsingør
Pages	98-103
Publication status	Published - 1996
MoE publication type	B3 Non-refereed article in conference proceedings
Event	33rd ISHM-Nordic conference - Helsingør, Denmark Duration: 22 Sept 1996 → 25 Sept 1996

Cite this

@inproceedings{a361dc7c5c9f47e5847bdf00c4c06efd,

title = "Electroplated solder bumps for flip chip",

author = "Jyrki Kaitila and P{\"a}ivi Majander and Jaakko Salonen and Ilkka Suni",

year = "1996",

language = "English",

pages = "98--103",

booktitle = "ISHM-Nordic 33rd Conference",

note = "33rd ISHM-Nordic conference ; Conference date: 22-09-1996 Through 25-09-1996",

}