@inproceedings{d40511f9fdfc4ad7a03da93a119f16f0,
title = "Embedded component packaging for D-band radio systems",
abstract = "The paper presents an embedded component packaging platform for D-band radio systems. The embedded component packaging is highly reliable due to optimal protection of the embedded components and good heat dissipation. Key elements of the platform are tested. The testing shows promising results in terms of insertion loss, achieving~0.5 dB per transition at 150 GHz. However, isolation of the RF lines feeding phased array chips should be improved in the next version of the platform.",
keywords = "D band, millimetre-wave, packaging, phased array",
author = "Mario Schober and Rio, {David del} and Alberto Chico and Vladimir Ermolov",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024 ; Conference date: 03-06-2024 Through 06-06-2024",
year = "2024",
doi = "10.1109/EuCNC/6GSummit60053.2024.10597115",
language = "English",
isbn = "979-8-3503-4500-1",
series = "European Conference on Networks and Communications",
publisher = "IEEE Institute of Electrical and Electronic Engineers",
pages = "1044--1048",
booktitle = "2024 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024",
address = "United States",
}