Abstract
The paper presents an embedded component packaging platform for D-band radio systems. The embedded component packaging is highly reliable due to optimal protection of the embedded components and good heat dissipation. Key elements of the platform are tested. The testing shows promising results in terms of insertion loss, achieving~0.5 dB per transition at 150 GHz. However, isolation of the RF lines feeding phased array chips should be improved in the next version of the platform.
| Original language | English |
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| Title of host publication | 2024 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024 |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 1044-1048 |
| ISBN (Electronic) | 979-8-3503-4499-8 |
| ISBN (Print) | 979-8-3503-4500-1 |
| DOIs | |
| Publication status | Published - 2024 |
| MoE publication type | A4 Article in a conference publication |
| Event | Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024 - Antwerp, Belgium Duration: 3 Jun 2024 → 6 Jun 2024 |
Publication series
| Series | European Conference on Networks and Communications |
|---|---|
| Volume | 2024 |
| ISSN | 2475-6490 |
Conference
| Conference | Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024 |
|---|---|
| Country/Territory | Belgium |
| City | Antwerp |
| Period | 3/06/24 → 6/06/24 |
Funding
This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699). We thank Mikko Kantanen for help in measuring test structures.
Keywords
- D band
- millimetre-wave
- packaging
- phased array