Estimates for the partial capasitance of a printed circuit board via

Johan C.-E. Sten, Tommi Dufva

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)

    Abstract

    A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface.
    Original languageEnglish
    Pages (from-to)160 - 163
    Number of pages4
    JournalMicrowave and Optical Technology Letters
    Volume20
    Issue number3
    DOIs
    Publication statusPublished - 1999
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    printed circuits
    circuit boards
    Printed circuit boards
    Capacitance
    capacitance
    estimates
    stopping
    Permittivity
    permittivity

    Keywords

    • interconnects
    • circuit board via
    • packaging

    Cite this

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    abstract = "A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface.",
    keywords = "interconnects, circuit board via, packaging",
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    doi = "10.1002/(SICI)1098-2760(19990205)20:3<160::AID-MOP3>3.0.CO;2-E",
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    journal = "Microwave and Optical Technology Letters",
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    Estimates for the partial capasitance of a printed circuit board via. / Sten, Johan C.-E.; Dufva, Tommi.

    In: Microwave and Optical Technology Letters, Vol. 20, No. 3, 1999, p. 160 - 163.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Estimates for the partial capasitance of a printed circuit board via

    AU - Sten, Johan C.-E.

    AU - Dufva, Tommi

    PY - 1999

    Y1 - 1999

    N2 - A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface.

    AB - A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface.

    KW - interconnects

    KW - circuit board via

    KW - packaging

    U2 - 10.1002/(SICI)1098-2760(19990205)20:3<160::AID-MOP3>3.0.CO;2-E

    DO - 10.1002/(SICI)1098-2760(19990205)20:3<160::AID-MOP3>3.0.CO;2-E

    M3 - Article

    VL - 20

    SP - 160

    EP - 163

    JO - Microwave and Optical Technology Letters

    JF - Microwave and Optical Technology Letters

    SN - 0895-2477

    IS - 3

    ER -