A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface.
|Pages (from-to)||160 - 163|
|Number of pages||4|
|Journal||Microwave and Optical Technology Letters|
|Publication status||Published - 1999|
|MoE publication type||A1 Journal article-refereed|
- circuit board via