Abstract
An atomic layer deposition (ALD) process was developed
for an important thermoelectric material Bi2Se3 utilizing
dechlorosilylation reactions between BiCl3 and (Et3Si)2Se
precursors. The applicability of this alkylsilyl selenide
precursor was confirmed, as reactions with BiCl3 produced
good quality thin films with low impurity contents.
Saturation of the growth rate with regards to the pulse
lengths of both precursors indicated that the Bi2Se3
process had characteristic ALD properties. Also, the film
thickness corresponded linearly with increasing number of
deposition cycles. No ALD window was discovered and the
growth rates decreased significantly with increasing
temperatures, similarly to other ALD processes utilizing
alkylsilyl chalcogenide precursors. Nevertheless, high
growth rates of 1.6 Å per cycle occurred at 160 °C. In
addition, a good thermoelectric response was shown.
Original language | English |
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Pages (from-to) | 4820-4828 |
Journal | Journal of Materials Chemistry C |
Volume | 3 |
Issue number | 18 |
DOIs | |
Publication status | Published - 2015 |
MoE publication type | A1 Journal article-refereed |