Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional


    Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.
    Original languageEnglish
    Title of host publicationBook of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016)
    PublisherWarsaw University of Technology
    Number of pages2
    ISBN (Print)978-83-64102-16-5
    Publication statusPublished - 2016
    MoE publication typeD3 Professional conference proceedings
    Event18th European Conference on Integrated Optics, ECIO 2016 - Warsaw, Poland
    Duration: 18 May 201620 May 2016


    Conference18th European Conference on Integrated Optics, ECIO 2016
    Abbreviated titleECIO'16


    • photonic integrated circuit
    • PIC
    • silicon-on-insulator
    • SOI
    • waveguide
    • total internal reflection
    • TIR
    • mirror
    • Euler bend


    Dive into the research topics of 'Euler bends and TIR mirrors for ultra-dense PIC integration on SOI'. Together they form a unique fingerprint.

    Cite this