Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional

Abstract

Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.
Original languageEnglish
Title of host publicationBook of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016)
PublisherWarsaw University of Technology
Number of pages2
ISBN (Print)978-83-64102-16-5
Publication statusPublished - 2016
MoE publication typeD3 Professional conference proceedings
Event18th European Conference on Integrated Optics, ECIO 2016 - Warsaw, Poland
Duration: 18 May 201620 May 2016

Conference

Conference18th European Conference on Integrated Optics, ECIO 2016
Abbreviated titleECIO'16
CountryPoland
CityWarsaw
Period18/05/1620/05/16

Fingerprint

integrated circuits
insulators
photonics
mirrors
silicon
micrometers
platforms
waveguides
fabrication
radii
polarization
wavelengths
simulation

Keywords

  • photonic integrated circuit
  • PIC
  • silicon-on-insulator
  • SOI
  • waveguide
  • total internal reflection
  • TIR
  • mirror
  • Euler bend

Cite this

Aalto, T., Harjanne, M., Cherchi, M., & Ylinen, S. (2016). Euler bends and TIR mirrors for ultra-dense PIC integration on SOI. In Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016) Warsaw University of Technology.
Aalto, Timo ; Harjanne, Mikko ; Cherchi, Matteo ; Ylinen, Sami. / Euler bends and TIR mirrors for ultra-dense PIC integration on SOI. Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016). Warsaw University of Technology, 2016.
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title = "Euler bends and TIR mirrors for ultra-dense PIC integration on SOI",
abstract = "Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.",
keywords = "photonic integrated circuit, PIC, silicon-on-insulator, SOI, waveguide, total internal reflection, TIR, mirror, Euler bend",
author = "Timo Aalto and Mikko Harjanne and Matteo Cherchi and Sami Ylinen",
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Aalto, T, Harjanne, M, Cherchi, M & Ylinen, S 2016, Euler bends and TIR mirrors for ultra-dense PIC integration on SOI. in Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016). Warsaw University of Technology, 18th European Conference on Integrated Optics, ECIO 2016, Warsaw, Poland, 18/05/16.

Euler bends and TIR mirrors for ultra-dense PIC integration on SOI. / Aalto, Timo; Harjanne, Mikko; Cherchi, Matteo; Ylinen, Sami.

Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016). Warsaw University of Technology, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional

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T1 - Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

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AU - Harjanne, Mikko

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N2 - Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.

AB - Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.

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KW - mirror

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M3 - Conference article in proceedings

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Aalto T, Harjanne M, Cherchi M, Ylinen S. Euler bends and TIR mirrors for ultra-dense PIC integration on SOI. In Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016). Warsaw University of Technology. 2016