Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

Timo Aalto; Mikko Harjanne; Matteo Cherchi; Sami Ylinen

Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Professional

Abstract

Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.

Original language	English
Title of host publication	Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016)
Publisher	Warsaw University of Technology
Number of pages	2
ISBN (Print)	978-83-64102-16-5
Publication status	Published - 2016
MoE publication type	D3 Professional conference proceedings
Event	18th European Conference on Integrated Optics, ECIO 2016 - Warsaw, Poland Duration: 18 May 2016 → 20 May 2016

Conference

Conference	18th European Conference on Integrated Optics, ECIO 2016
Abbreviated title	ECIO'16
Country/Territory	Poland
City	Warsaw
Period	18/05/16 → 20/05/16

Keywords

photonic integrated circuit
PIC
silicon-on-insulator
SOI
waveguide
total internal reflection
TIR
mirror
Euler bend

Access to Document

http://www.ecio-conference.org/wp-content/uploads/2016/06/ECIO-o-20.pdf

Cite this

@inproceedings{833d5d194cda432598da0c03fb9f43d3,

title = "Euler bends and TIR mirrors for ultra-dense PIC integration on SOI",

abstract = "Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and \textasciitilde{}0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.",

keywords = "photonic integrated circuit, PIC, silicon-on-insulator, SOI, waveguide, total internal reflection, TIR, mirror, Euler bend",

author = "Timo Aalto and Mikko Harjanne and Matteo Cherchi and Sami Ylinen",

note = "Project : 100878 ; 18th European Conference on Integrated Optics, ECIO 2016, ECIO'16 ; Conference date: 18-05-2016 Through 20-05-2016",

year = "2016",

language = "English",

isbn = "978-83-64102-16-5",

booktitle = "Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016)",

publisher = "Warsaw University of Technology",

address = "Poland",

}

Aalto, T , Harjanne, M, Cherchi, M & Ylinen, S 2016, Euler bends and TIR mirrors for ultra-dense PIC integration on SOI. in Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016). Warsaw University of Technology, 18th European Conference on Integrated Optics, ECIO 2016, Warsaw, Poland, 18/05/16. <http://www.ecio-conference.org/wp-content/uploads/2016/06/ECIO-o-20.pdf>

TY - GEN

T1 - Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Cherchi, Matteo

AU - Ylinen, Sami

N1 - Project : 100878

PY - 2016

Y1 - 2016

N2 - Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.

AB - Photonic integrated circuits (PICs) can be realized on multiple technology platforms that all have their own strengths and limitations. In this paper we describe some of the latest results in the ultra-dense integration of PICs using 3 µm thick silicon-on-insulator (SOI) waveguides. In particular we describe the design, fabrication and testing of Euler bends and total internal reflection (TIR) mirrors that both allow to turn light e.g. 90° with an effective bending radius of a few micrometers and ~0.1 dB90° or smaller loss. For the Euler bends we also introduce a concept that allows designers to draw bends without the need to perform numerical simulations for each bend angle, wavelength and polarization that they want to use in the PIC.

KW - photonic integrated circuit

KW - PIC

KW - silicon-on-insulator

KW - SOI

KW - waveguide

KW - total internal reflection

KW - TIR

KW - mirror

KW - Euler bend

M3 - Conference article in proceedings

SN - 978-83-64102-16-5

BT - Book of abstracts of the 18th European Conference on Integrated Optics (ECIO 2016)

PB - Warsaw University of Technology

T2 - 18th European Conference on Integrated Optics, ECIO 2016

Y2 - 18 May 2016 through 20 May 2016

ER -

Euler bends and TIR mirrors for ultra-dense PIC integration on SOI

Abstract

Conference

Keywords

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Cite this