Abstract
Small electronic devices are nowadays used in varying
conditions, which expose them to stresses, which should
be recognized and take into account in the planning work.
The exact structure of the devices of interest may be
very complicated to be used in diffusion and fluid
mechanical calculations. Therefore, we performed leakage
analysis, fitted to approximate analytical diffusion and
air-exchange models, by helium injection method for one
mobile phone type. In order to extend the applicability
of our models we developed a more complicated numerical
model for diffusion, thermal conduction and free
convection inside the phone. The application of numerical
model led an estimated range of values of 3 - 10 1/h for
air-exchange coefficients in case of operational mobile
phone.
Original language | English |
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Title of host publication | Proceedings of the Nordic Comsol Conference 2006 Copenhagen. November, 1-2, 2006 |
Publisher | COMSOL |
Pages | 123-128 |
ISBN (Print) | 87-989426-1-1 |
Publication status | Published - 2006 |
MoE publication type | A4 Article in a conference publication |
Event | Nordic Comsol Conference 2006 - Copenhagen, Denmark Duration: 1 Nov 2006 → 2 Nov 2006 |
Conference
Conference | Nordic Comsol Conference 2006 |
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Country/Territory | Denmark |
City | Copenhagen |
Period | 1/11/06 → 2/11/06 |
Keywords
- portable device
- air exchange
- flow model
- helium