Exploring materials and technologies for printable optics and electronics utilised in intelligent packaging

Harri Kopola; Terho Kololuoma; Tapio Mäkelä; Hannu Linna; Tomi Haring; Juha Hagberg; Jani Kallioinen; Ilkka Kettunen

Exploring materials and technologies for printable optics and electronics utilised in intelligent packaging

Harri Kopola, Terho Kololuoma, Tapio Mäkelä, Hannu Linna, Tomi Haring, Juha Hagberg, Jani Kallioinen, Ilkka Kettunen

Research output: Contribution to conference › Conference article › Scientific

Abstract

The technologies for printable optics and electronics are described which are used in intelligent packaging. The passive and active electrical fabrication, optical and optoelectronic elements using roll-to-roll processes are also described for low price level products. The technologies for printable optics include gravure- printing, flexo-printing, offset printing and ink jets. The light guides are applied to visual effects and data transfer with fabrication techniques including ink-jet, gravure and hot-embossed grooves.

Original language	English
Pages	103-125
Publication status	Published - 2003
MoE publication type	Not Eligible
Event	Smart and Intelligent Packaging 2003 - Barcelona, Spain Duration: 28 Oct 2003 → 29 Oct 2003

Conference

Conference	Smart and Intelligent Packaging 2003
Country/Territory	Spain
City	Barcelona
Period	28/10/03 → 29/10/03

Cite this

@conference{278e36b7add64564bc06a7f701296e91,

title = "Exploring materials and technologies for printable optics and electronics utilised in intelligent packaging",

abstract = "The technologies for printable optics and electronics are described which are used in intelligent packaging. The passive and active electrical fabrication, optical and optoelectronic elements using roll-to-roll processes are also described for low price level products. The technologies for printable optics include gravure- printing, flexo-printing, offset printing and ink jets. The light guides are applied to visual effects and data transfer with fabrication techniques including ink-jet, gravure and hot-embossed grooves.",

author = "Harri Kopola and Terho Kololuoma and Tapio M{\"a}kel{\"a} and Hannu Linna and Tomi Haring and Juha Hagberg and Jani Kallioinen and Ilkka Kettunen",

year = "2003",

language = "English",

pages = "103--125",

note = "Smart and Intelligent Packaging 2003 ; Conference date: 28-10-2003 Through 29-10-2003",

}

TY - CONF

T1 - Exploring materials and technologies for printable optics and electronics utilised in intelligent packaging

AU - Kopola, Harri

AU - Kololuoma, Terho

AU - Mäkelä, Tapio

AU - Linna, Hannu

AU - Haring, Tomi

AU - Hagberg, Juha

AU - Kallioinen, Jani

AU - Kettunen, Ilkka

PY - 2003

Y1 - 2003

N2 - The technologies for printable optics and electronics are described which are used in intelligent packaging. The passive and active electrical fabrication, optical and optoelectronic elements using roll-to-roll processes are also described for low price level products. The technologies for printable optics include gravure- printing, flexo-printing, offset printing and ink jets. The light guides are applied to visual effects and data transfer with fabrication techniques including ink-jet, gravure and hot-embossed grooves.

AB - The technologies for printable optics and electronics are described which are used in intelligent packaging. The passive and active electrical fabrication, optical and optoelectronic elements using roll-to-roll processes are also described for low price level products. The technologies for printable optics include gravure- printing, flexo-printing, offset printing and ink jets. The light guides are applied to visual effects and data transfer with fabrication techniques including ink-jet, gravure and hot-embossed grooves.

M3 - Conference article

SP - 103

EP - 125

T2 - Smart and Intelligent Packaging 2003

Y2 - 28 October 2003 through 29 October 2003

ER -

Exploring materials and technologies for printable optics and electronics utilised in intelligent packaging

Abstract

Conference

Fingerprint

Cite this