Fabrication and characterization of screen printed stretchable carbon interconnects

Mahmoud Mosallaei; Behnam Khorramdel; Mari Honkanen; Pekka Iso-Ketola; Jukka Vanhala; Matti Mäntysalo

doi:10.1109/NORDPAC.2017.7993169

Fabrication and characterization of screen printed stretchable carbon interconnects

Mahmoud Mosallaei
, Behnam Khorramdel
, Mari Honkanen
, Pekka Iso-Ketola
, Jukka Vanhala
, Matti Mäntysalo

Not published at VTT

Tampere University of Technology (TUT)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Abstract

Electronic devices that are deformable in arbitrary directions would open up a new generation of applications such as epidermal electronics, implantable electronics and soft robotics. It would not be feasible to fabricate them with conventional rigid materials. To make the electronics stretchable, one can miniaturize the functional units and link them by stretchable interconnects. In this paper, we report a method for fabrication and characterization of stretchable interconnects using deformable materials based on carbon ink and thermoplastic polyurethane. The static resistances of interconnects were on average 296 Ω/□, and half of the samples withstood single strain up to 108 % elongation. Fabricated samples survived a 1000 cycles strain test up to 40 % of stretching.

Original language	English
Title of host publication	2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	78-83
ISBN (Electronic)	978-1-5386-3055-6
ISBN (Print)	978-1-5386-3056-3
DOIs	https://doi.org/10.1109/NORDPAC.2017.7993169
Publication status	Published - 26 Jul 2017
MoE publication type	A4 Article in a conference publication
Event	2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017 - Goteborg, Sweden Duration: 18 Jun 2017 → 20 Jun 2017

Conference

Conference	2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017
Country/Territory	Sweden
City	Goteborg
Period	18/06/17 → 20/06/17

Funding

The authors acknowledge the financial support provided by DISSE Project (Disappearing Sensors), TEKES grant no: 570/31/2015. M.Mäntysalo is supported by Academy of Finland grant Nos.288945 and 294119.

Keywords

printed electronics
screen printing
stretchable electronics
viscoelastic substrates

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10.1109/NORDPAC.2017.7993169

Cite this

Mosallaei, M., Khorramdel, B., Honkanen, M., Iso-Ketola, P., Vanhala, J., & Mäntysalo, M. (2017). Fabrication and characterization of screen printed stretchable carbon interconnects. In 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017 (pp. 78-83). Article 7993169 IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/NORDPAC.2017.7993169

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title = "Fabrication and characterization of screen printed stretchable carbon interconnects",

abstract = "Electronic devices that are deformable in arbitrary directions would open up a new generation of applications such as epidermal electronics, implantable electronics and soft robotics. It would not be feasible to fabricate them with conventional rigid materials. To make the electronics stretchable, one can miniaturize the functional units and link them by stretchable interconnects. In this paper, we report a method for fabrication and characterization of stretchable interconnects using deformable materials based on carbon ink and thermoplastic polyurethane. The static resistances of interconnects were on average 296 Ω/□, and half of the samples withstood single strain up to 108 \% elongation. Fabricated samples survived a 1000 cycles strain test up to 40 \% of stretching.",

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Mosallaei, M, Khorramdel, B, Honkanen, M, Iso-Ketola, P, Vanhala, J & Mäntysalo, M 2017, Fabrication and characterization of screen printed stretchable carbon interconnects. in 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017., 7993169, IEEE Institute of Electrical and Electronic Engineers, pp. 78-83, 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18/06/17. https://doi.org/10.1109/NORDPAC.2017.7993169

Fabrication and characterization of screen printed stretchable carbon interconnects. / Mosallaei, Mahmoud; Khorramdel, Behnam; Honkanen, Mari et al.
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017. IEEE Institute of Electrical and Electronic Engineers, 2017. p. 78-83 7993169.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Mosallaei, Mahmoud

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AU - Honkanen, Mari

AU - Iso-Ketola, Pekka

AU - Vanhala, Jukka

AU - Mäntysalo, Matti

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KW - printed electronics

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KW - viscoelastic substrates

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Fabrication and characterization of screen printed stretchable carbon interconnects

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