Fabrication method to create high-aspect ratio pillars for photonic coupling of board level interconnects
C. Debaes, J. Van Erps, Mikko Karppinen, Jussi Hiltunen, H. Suyal, A. Last, M. G. Lee, Pentti Karioja, M. Taghizadeh, J. Mohr, H. Thienpont, A. L. Glebov
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