Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Massimiliano Dispenza, Roberta Buttiglione, Anna Maria Fiorello, Jarkko Tuominen, Kari Kautio, Ollila Jyrki, Pentti Korhonen, Manu Lahdes, Daniele Pochesci, Kari Rönkä, S. Catoni, R. Marcelli, V. Foglietti, E. Cianci, A. Coppa

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

    Abstract

    Fabrication of high performance thin-film RF-MEMS structures directly on surface treated LTCC substrates has been investigated and demonstrated. After extensive testing of different LTCC materials as well as the characterization of lapping and polishing conditions, Heraeus CT707 was chosen as substrate material. The fabrication process for high performance thin film patterning and RF-MEMS structures has been developed, optimised and demonstrated. The release process for RF-MEMS structures has been optimised taking also into account the compatibility with LTCC materials. Also, hermetic sealing for the MEMS structures using brazing both with Kovar and ceramic lids has been designed, optimised and demonstrated.
    Original languageEnglish
    Title of host publicationProceedings
    Subtitle of host publication16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007
    PublisherCurran Associates Inc.
    Pages364-369
    ISBN (Print)978-1-6227-6466-2
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    Event16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland
    Duration: 17 Jun 200720 Jun 2007

    Conference

    Conference16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
    CountryFinland
    CityOulu
    Period17/06/0720/06/07

    Keywords

    • Thin Film
    • MEMS
    • LTCC
    • polishing
    • true Time Delay

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