Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Massimiliano Dispenza; Roberta Buttiglione; Anna Maria Fiorello; Jarkko Tuominen; Kari Kautio; Ollila Jyrki; Pentti Korhonen; Manu Lahdes; Daniele Pochesci; Kari Rönkä; S. Catoni; R. Marcelli; V. Foglietti; E. Cianci; A. Coppa

Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Massimiliano Dispenza, Roberta Buttiglione, Anna Maria Fiorello, Jarkko Tuominen, Kari Kautio, Ollila Jyrki, Pentti Korhonen, Manu Lahdes, Daniele Pochesci, Kari Rönkä, S. Catoni, R. Marcelli, V. Foglietti, E. Cianci, A. Coppa

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Abstract

Fabrication of high performance thin-film RF-MEMS structures directly on surface treated LTCC substrates has been investigated and demonstrated. After extensive testing of different LTCC materials as well as the characterization of lapping and polishing conditions, Heraeus CT707 was chosen as substrate material. The fabrication process for high performance thin film patterning and RF-MEMS structures has been developed, optimised and demonstrated. The release process for RF-MEMS structures has been optimised taking also into account the compatibility with LTCC materials. Also, hermetic sealing for the MEMS structures using brazing both with Kovar and ceramic lids has been designed, optimised and demonstrated.

Original language	English
Title of host publication	Proceedings
Subtitle of host publication	16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007
Publisher	Curran Associates Inc.
Pages	364-369
ISBN (Print)	978-1-6227-6466-2
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007

Conference

Conference	16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
Country/Territory	Finland
City	Oulu
Period	17/06/07 → 20/06/07

Keywords

Thin Film
MEMS
LTCC
polishing
true Time Delay

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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Dispenza, M., Buttiglione, R., Fiorello, A. M., Tuominen, J., Kautio, K., Jyrki, O., Korhonen, P., Lahdes, M., Pochesci, D., Rönkä, K., Catoni, S., Marcelli, R., Foglietti, V., Cianci, E., & Coppa, A. (2007). Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 (pp. 364-369). Curran Associates Inc..

@inproceedings{b1c2cb853730462582bac05785a3fd0d,

title = "Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates",

abstract = "Fabrication of high performance thin-film RF-MEMS structures directly on surface treated LTCC substrates has been investigated and demonstrated. After extensive testing of different LTCC materials as well as the characterization of lapping and polishing conditions, Heraeus CT707 was chosen as substrate material. The fabrication process for high performance thin film patterning and RF-MEMS structures has been developed, optimised and demonstrated. The release process for RF-MEMS structures has been optimised taking also into account the compatibility with LTCC materials. Also, hermetic sealing for the MEMS structures using brazing both with Kovar and ceramic lids has been designed, optimised and demonstrated.",

keywords = "Thin Film, MEMS, LTCC, polishing, true Time Delay",

author = "Massimiliano Dispenza and Roberta Buttiglione and Fiorello, {Anna Maria} and Jarkko Tuominen and Kari Kautio and Ollila Jyrki and Pentti Korhonen and Manu Lahdes and Daniele Pochesci and Kari R{\"o}nk{\"a} and S. Catoni and R. Marcelli and V. Foglietti and E. Cianci and A. Coppa",

note = "Project code: 497; 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 ; Conference date: 17-06-2007 Through 20-06-2007",

year = "2007",

language = "English",

isbn = "978-1-6227-6466-2",

pages = "364--369",

booktitle = "Proceedings",

publisher = "Curran Associates Inc.",

address = "United States",

}

Dispenza, M, Buttiglione, R, Fiorello, AM, Tuominen, J, Kautio, K, Jyrki, O, Korhonen, P, Lahdes, M, Pochesci, D, Rönkä, K, Catoni, S, Marcelli, R, Foglietti, V, Cianci, E & Coppa, A 2007, Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates. in Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., pp. 364-369, 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, Oulu, Finland, 17/06/07.

Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates. / Dispenza, Massimiliano; Buttiglione, Roberta; Fiorello, Anna Maria et al.
Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., 2007. p. 364-369.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

AU - Dispenza, Massimiliano

AU - Buttiglione, Roberta

AU - Fiorello, Anna Maria

AU - Tuominen, Jarkko

AU - Kautio, Kari

AU - Jyrki, Ollila

AU - Korhonen, Pentti

AU - Lahdes, Manu

AU - Pochesci, Daniele

AU - Rönkä, Kari

AU - Catoni, S.

AU - Marcelli, R.

AU - Foglietti, V.

AU - Cianci, E.

AU - Coppa, A.

N1 - Project code: 497

PY - 2007

Y1 - 2007

N2 - Fabrication of high performance thin-film RF-MEMS structures directly on surface treated LTCC substrates has been investigated and demonstrated. After extensive testing of different LTCC materials as well as the characterization of lapping and polishing conditions, Heraeus CT707 was chosen as substrate material. The fabrication process for high performance thin film patterning and RF-MEMS structures has been developed, optimised and demonstrated. The release process for RF-MEMS structures has been optimised taking also into account the compatibility with LTCC materials. Also, hermetic sealing for the MEMS structures using brazing both with Kovar and ceramic lids has been designed, optimised and demonstrated.

AB - Fabrication of high performance thin-film RF-MEMS structures directly on surface treated LTCC substrates has been investigated and demonstrated. After extensive testing of different LTCC materials as well as the characterization of lapping and polishing conditions, Heraeus CT707 was chosen as substrate material. The fabrication process for high performance thin film patterning and RF-MEMS structures has been developed, optimised and demonstrated. The release process for RF-MEMS structures has been optimised taking also into account the compatibility with LTCC materials. Also, hermetic sealing for the MEMS structures using brazing both with Kovar and ceramic lids has been designed, optimised and demonstrated.

KW - Thin Film

KW - MEMS

KW - LTCC

KW - polishing

KW - true Time Delay

M3 - Conference article in proceedings

SN - 978-1-6227-6466-2

SP - 364

EP - 369

BT - Proceedings

PB - Curran Associates Inc.

T2 - 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Y2 - 17 June 2007 through 20 June 2007

ER -

Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Abstract

Conference

Keywords

UN SDGs

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