Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Massimiliano Dispenza, Roberta Buttiglione, Anna Maria Fiorello, Jarkko Tuominen, Kari Kautio, Ollila Jyrki, Pentti Korhonen, Manu Lahdes, Daniele Pochesci, Kari Rönkä, S. Catoni, R. Marcelli, V. Foglietti, E. Cianci, A. Coppa

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

Fabrication of high performance thin-film RF-MEMS structures directly on surface treated LTCC substrates has been investigated and demonstrated. After extensive testing of different LTCC materials as well as the characterization of lapping and polishing conditions, Heraeus CT707 was chosen as substrate material. The fabrication process for high performance thin film patterning and RF-MEMS structures has been developed, optimised and demonstrated. The release process for RF-MEMS structures has been optimised taking also into account the compatibility with LTCC materials. Also, hermetic sealing for the MEMS structures using brazing both with Kovar and ceramic lids has been designed, optimised and demonstrated.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007
PublisherCurran Associates Inc.
Pages364-369
ISBN (Print)978-1-6227-6466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Keywords

  • Thin Film
  • MEMS
  • LTCC
  • polishing
  • true Time Delay

Fingerprint Dive into the research topics of 'Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates'. Together they form a unique fingerprint.

  • Cite this

    Dispenza, M., Buttiglione, R., Fiorello, A. M., Tuominen, J., Kautio, K., Jyrki, O., Korhonen, P., Lahdes, M., Pochesci, D., Rönkä, K., Catoni, S., Marcelli, R., Foglietti, V., Cianci, E., & Coppa, A. (2007). Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 (pp. 364-369). Curran Associates Inc..