Abstract
Fabrication of high performance thin-film RF-MEMS structures directly on
surface treated LTCC substrates has been investigated and demonstrated. After
extensive testing of different LTCC materials as well as the characterization
of lapping and polishing conditions, Heraeus CT707 was chosen as substrate
material. The fabrication process for high performance thin film patterning
and RF-MEMS structures has been developed, optimised and demonstrated. The
release process for RF-MEMS structures has been optimised taking also into
account the compatibility with LTCC materials. Also, hermetic sealing for the
MEMS structures using brazing both with Kovar and ceramic lids has been
designed, optimised and demonstrated.
Original language | English |
---|---|
Title of host publication | Proceedings |
Subtitle of host publication | 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 |
Publisher | Curran Associates Inc. |
Pages | 364-369 |
ISBN (Print) | 978-1-6227-6466-2 |
Publication status | Published - 2007 |
MoE publication type | A4 Article in a conference publication |
Event | 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 |
Conference
Conference | 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 |
---|---|
Country/Territory | Finland |
City | Oulu |
Period | 17/06/07 → 20/06/07 |
Keywords
- Thin Film
- MEMS
- LTCC
- polishing
- true Time Delay