Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging
- Fan Ji*
- , Seppo Leppävuori
- , Ismo Luusua
- , Kimmo Henttinen
- , Simo Eränen
- , Iiro Hietanen
- , Mikko Juntunen
*Corresponding author for this work
- Detection Technology Oyj
- University of Oulu
Research output: Contribution to journal › Article › Scientific › peer-review
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(Scopus)