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Fabrication of silicon diaphragms by mechanical thinning
Hannu Luoto
, Tommi Suni
, Kimmo Henttinen
, James Dekker
Research output
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Contribution to conference
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Conference article
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Scientific
Overview
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Dive into the research topics of 'Fabrication of silicon diaphragms by mechanical thinning'. Together they form a unique fingerprint.
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Keyphrases
Wafer
100%
SOI Wafer
100%
Silicon Diaphragm
100%
Mechanical Thinning
100%
Fabrication Methods
66%
Support Structure
66%
MEMS Devices
66%
Top-bottom
66%
Cavity Fabrication
66%
Oxides
33%
Special Care
33%
Particle-free
33%
Cavity Size
33%
Cavity Shape
33%
Cavity Location
33%
Buried Structures
33%
INIS
silicon
100%
cavities
100%
fabrication
100%
diaphragm
100%
devices
42%
size
28%
shape
28%
surfaces
14%
bonding
14%
oxides
14%
demand
14%
increasing
14%
range
14%
particles
14%
atmospheres
14%
Engineering
Diaphragm
100%
Microelectromechanical System
100%
Particle Surface
33%
Smooth Surface
33%
Buried Structure
33%
Material Science
Microelectromechanical System
100%
Silicon
100%
Oxide Compound
33%