Fabrication tolerant flat-top interleavers

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    3 Citations (Scopus)

    Abstract

    Integrated circuits based on micron-scale silicon waveguides have the clear advantage of being tolerant to fabrication errors, thanks to the high mode confinement within the guiding core. Here we show how flat-top interleavers can be achieved on a micron-scale silicon photonics platform based on ring-loaded Mach-Zehnder Interferometers (MZIs), without the need for any thermal tuning. Robust designs are also guaranteed by resorting to Multi-Mode Interferometers (MMIs) as power splitters in both the MZIs and the ring resonators. A trade-off between in-band ripple and roll-off can be achieved by changing the ring splitting ratios. In particular rings with different finesse based on MMIs with 50:50, 72:28, and 85:15 splitting ratios have been designed, fabricated and successfully tested. In-band ripples as low as 0.2 dB and extinction ratios exceeding 15 dB have been measured from the fabricated samples. Repeatability of the performances from chip to chip and wafer to wafer is presented to show the tolerance of the devices to fabrication errors. Even though these particular devices have been designed for TE polarization only, polarization insensitive designs can be also achieved. All designs are based on strip waveguides and compact Euler-bends, leading to footprints in the order of 700x300 µm2, also thanks to an optimized configuration. They can find applications as interleavers as such or as stages in cascades of N interleavers to achieve flat-top 1x2N (de)multiplexers.
    Original languageEnglish
    Title of host publicationSilicon Photonics XII
    EditorsAndrew P. Knights, Graham T. Reed
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Electronic)9781510606579
    ISBN (Print)978-1-5106-0657-9
    DOIs
    Publication statusPublished - 1 Jan 2017
    MoE publication typeA4 Article in a conference publication
    EventSilicon Photonics XII: SPIE OPTO 2017 - San Francisco, United States
    Duration: 30 Jan 20171 Feb 2017

    Publication series

    SeriesProceedings of SPIE
    Volume10108
    ISSN0277-786X

    Conference

    ConferenceSilicon Photonics XII
    CountryUnited States
    CitySan Francisco
    Period30/01/171/02/17

    Fingerprint

    Fabrication
    Mach-Zehnder Interferometer
    Mach-Zehnder interferometers
    Ripple
    Silicon
    Ring
    Interferometer
    Wafer
    Interferometers
    fabrication
    Waveguide
    rings
    Waveguides
    Chip
    Polarization
    ripples
    Silicon Photonics
    Ring Resonator
    interferometers
    Robust Design

    Keywords

    • flat-top filters
    • integrated optics
    • multimode interference splitters
    • photonic integrated circuits
    • ring resonators
    • silicon photonics
    • WDM filters

    Cite this

    Cherchi, M., Sun, F., Kapulainen, M., Vehmas, T., Harjanne, M., & Aalto, T. (2017). Fabrication tolerant flat-top interleavers. In A. P. Knights, & G. T. Reed (Eds.), Silicon Photonics XII [101080V] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 10108 https://doi.org/10.1117/12.2252110
    Cherchi, Matteo ; Sun, Fei ; Kapulainen, Markku ; Vehmas, Tapani ; Harjanne, Mikko ; Aalto, Timo. / Fabrication tolerant flat-top interleavers. Silicon Photonics XII. editor / Andrew P. Knights ; Graham T. Reed. International Society for Optics and Photonics SPIE, 2017. (Proceedings of SPIE, Vol. 10108).
    @inproceedings{59ef7fb45e0f4e8da86d3447129a394a,
    title = "Fabrication tolerant flat-top interleavers",
    abstract = "Integrated circuits based on micron-scale silicon waveguides have the clear advantage of being tolerant to fabrication errors, thanks to the high mode confinement within the guiding core. Here we show how flat-top interleavers can be achieved on a micron-scale silicon photonics platform based on ring-loaded Mach-Zehnder Interferometers (MZIs), without the need for any thermal tuning. Robust designs are also guaranteed by resorting to Multi-Mode Interferometers (MMIs) as power splitters in both the MZIs and the ring resonators. A trade-off between in-band ripple and roll-off can be achieved by changing the ring splitting ratios. In particular rings with different finesse based on MMIs with 50:50, 72:28, and 85:15 splitting ratios have been designed, fabricated and successfully tested. In-band ripples as low as 0.2 dB and extinction ratios exceeding 15 dB have been measured from the fabricated samples. Repeatability of the performances from chip to chip and wafer to wafer is presented to show the tolerance of the devices to fabrication errors. Even though these particular devices have been designed for TE polarization only, polarization insensitive designs can be also achieved. All designs are based on strip waveguides and compact Euler-bends, leading to footprints in the order of 700x300 µm2, also thanks to an optimized configuration. They can find applications as interleavers as such or as stages in cascades of N interleavers to achieve flat-top 1x2N (de)multiplexers.",
    keywords = "flat-top filters, integrated optics, multimode interference splitters, photonic integrated circuits, ring resonators, silicon photonics, WDM filters",
    author = "Matteo Cherchi and Fei Sun and Markku Kapulainen and Tapani Vehmas and Mikko Harjanne and Timo Aalto",
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    Cherchi, M, Sun, F, Kapulainen, M, Vehmas, T, Harjanne, M & Aalto, T 2017, Fabrication tolerant flat-top interleavers. in AP Knights & GT Reed (eds), Silicon Photonics XII., 101080V, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 10108, Silicon Photonics XII, San Francisco, United States, 30/01/17. https://doi.org/10.1117/12.2252110

    Fabrication tolerant flat-top interleavers. / Cherchi, Matteo; Sun, Fei; Kapulainen, Markku; Vehmas, Tapani; Harjanne, Mikko; Aalto, Timo.

    Silicon Photonics XII. ed. / Andrew P. Knights; Graham T. Reed. International Society for Optics and Photonics SPIE, 2017. 101080V (Proceedings of SPIE, Vol. 10108).

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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    AU - Aalto, Timo

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    N2 - Integrated circuits based on micron-scale silicon waveguides have the clear advantage of being tolerant to fabrication errors, thanks to the high mode confinement within the guiding core. Here we show how flat-top interleavers can be achieved on a micron-scale silicon photonics platform based on ring-loaded Mach-Zehnder Interferometers (MZIs), without the need for any thermal tuning. Robust designs are also guaranteed by resorting to Multi-Mode Interferometers (MMIs) as power splitters in both the MZIs and the ring resonators. A trade-off between in-band ripple and roll-off can be achieved by changing the ring splitting ratios. In particular rings with different finesse based on MMIs with 50:50, 72:28, and 85:15 splitting ratios have been designed, fabricated and successfully tested. In-band ripples as low as 0.2 dB and extinction ratios exceeding 15 dB have been measured from the fabricated samples. Repeatability of the performances from chip to chip and wafer to wafer is presented to show the tolerance of the devices to fabrication errors. Even though these particular devices have been designed for TE polarization only, polarization insensitive designs can be also achieved. All designs are based on strip waveguides and compact Euler-bends, leading to footprints in the order of 700x300 µm2, also thanks to an optimized configuration. They can find applications as interleavers as such or as stages in cascades of N interleavers to achieve flat-top 1x2N (de)multiplexers.

    AB - Integrated circuits based on micron-scale silicon waveguides have the clear advantage of being tolerant to fabrication errors, thanks to the high mode confinement within the guiding core. Here we show how flat-top interleavers can be achieved on a micron-scale silicon photonics platform based on ring-loaded Mach-Zehnder Interferometers (MZIs), without the need for any thermal tuning. Robust designs are also guaranteed by resorting to Multi-Mode Interferometers (MMIs) as power splitters in both the MZIs and the ring resonators. A trade-off between in-band ripple and roll-off can be achieved by changing the ring splitting ratios. In particular rings with different finesse based on MMIs with 50:50, 72:28, and 85:15 splitting ratios have been designed, fabricated and successfully tested. In-band ripples as low as 0.2 dB and extinction ratios exceeding 15 dB have been measured from the fabricated samples. Repeatability of the performances from chip to chip and wafer to wafer is presented to show the tolerance of the devices to fabrication errors. Even though these particular devices have been designed for TE polarization only, polarization insensitive designs can be also achieved. All designs are based on strip waveguides and compact Euler-bends, leading to footprints in the order of 700x300 µm2, also thanks to an optimized configuration. They can find applications as interleavers as such or as stages in cascades of N interleavers to achieve flat-top 1x2N (de)multiplexers.

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    KW - integrated optics

    KW - multimode interference splitters

    KW - photonic integrated circuits

    KW - ring resonators

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    KW - WDM filters

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    Cherchi M, Sun F, Kapulainen M, Vehmas T, Harjanne M, Aalto T. Fabrication tolerant flat-top interleavers. In Knights AP, Reed GT, editors, Silicon Photonics XII. International Society for Optics and Photonics SPIE. 2017. 101080V. (Proceedings of SPIE, Vol. 10108). https://doi.org/10.1117/12.2252110