Fabrication tolerant flat-top interleavers

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)

Abstract

Integrated circuits based on micron-scale silicon waveguides have the clear advantage of being tolerant to fabrication errors, thanks to the high mode confinement within the guiding core. Here we show how flat-top interleavers can be achieved on a micron-scale silicon photonics platform based on ring-loaded Mach-Zehnder Interferometers (MZIs), without the need for any thermal tuning. Robust designs are also guaranteed by resorting to Multi-Mode Interferometers (MMIs) as power splitters in both the MZIs and the ring resonators. A trade-off between in-band ripple and roll-off can be achieved by changing the ring splitting ratios. In particular rings with different finesse based on MMIs with 50:50, 72:28, and 85:15 splitting ratios have been designed, fabricated and successfully tested. In-band ripples as low as 0.2 dB and extinction ratios exceeding 15 dB have been measured from the fabricated samples. Repeatability of the performances from chip to chip and wafer to wafer is presented to show the tolerance of the devices to fabrication errors. Even though these particular devices have been designed for TE polarization only, polarization insensitive designs can be also achieved. All designs are based on strip waveguides and compact Euler-bends, leading to footprints in the order of 700x300 µm2, also thanks to an optimized configuration. They can find applications as interleavers as such or as stages in cascades of N interleavers to achieve flat-top 1x2N (de)multiplexers.
Original languageEnglish
Title of host publicationSilicon Photonics XII
EditorsAndrew P. Knights, Graham T. Reed
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Electronic)9781510606579
ISBN (Print)978-1-5106-0657-9
DOIs
Publication statusPublished - 1 Jan 2017
MoE publication typeA4 Article in a conference publication
EventSilicon Photonics XII: SPIE OPTO 2017 - San Francisco, United States
Duration: 30 Jan 20171 Feb 2017

Publication series

SeriesProceedings of SPIE
Volume10108
ISSN0277-786X

Conference

ConferenceSilicon Photonics XII
CountryUnited States
CitySan Francisco
Period30/01/171/02/17

Fingerprint

Fabrication
Mach-Zehnder Interferometer
Mach-Zehnder interferometers
Ripple
Silicon
Ring
Interferometer
Wafer
Interferometers
fabrication
Waveguide
rings
Waveguides
Chip
Polarization
ripples
Silicon Photonics
Ring Resonator
interferometers
Robust Design

Keywords

  • flat-top filters
  • integrated optics
  • multimode interference splitters
  • photonic integrated circuits
  • ring resonators
  • silicon photonics
  • WDM filters

Cite this

Cherchi, M., Sun, F., Kapulainen, M., Vehmas, T., Harjanne, M., & Aalto, T. (2017). Fabrication tolerant flat-top interleavers. In A. P. Knights, & G. T. Reed (Eds.), Silicon Photonics XII [101080V] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 10108 https://doi.org/10.1117/12.2252110
Cherchi, Matteo ; Sun, Fei ; Kapulainen, Markku ; Vehmas, Tapani ; Harjanne, Mikko ; Aalto, Timo. / Fabrication tolerant flat-top interleavers. Silicon Photonics XII. editor / Andrew P. Knights ; Graham T. Reed. International Society for Optics and Photonics SPIE, 2017. (Proceedings of SPIE, Vol. 10108).
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Cherchi, M, Sun, F, Kapulainen, M, Vehmas, T, Harjanne, M & Aalto, T 2017, Fabrication tolerant flat-top interleavers. in AP Knights & GT Reed (eds), Silicon Photonics XII., 101080V, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 10108, Silicon Photonics XII, San Francisco, United States, 30/01/17. https://doi.org/10.1117/12.2252110

Fabrication tolerant flat-top interleavers. / Cherchi, Matteo; Sun, Fei; Kapulainen, Markku; Vehmas, Tapani; Harjanne, Mikko; Aalto, Timo.

Silicon Photonics XII. ed. / Andrew P. Knights; Graham T. Reed. International Society for Optics and Photonics SPIE, 2017. 101080V (Proceedings of SPIE, Vol. 10108).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Aalto, Timo

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N2 - Integrated circuits based on micron-scale silicon waveguides have the clear advantage of being tolerant to fabrication errors, thanks to the high mode confinement within the guiding core. Here we show how flat-top interleavers can be achieved on a micron-scale silicon photonics platform based on ring-loaded Mach-Zehnder Interferometers (MZIs), without the need for any thermal tuning. Robust designs are also guaranteed by resorting to Multi-Mode Interferometers (MMIs) as power splitters in both the MZIs and the ring resonators. A trade-off between in-band ripple and roll-off can be achieved by changing the ring splitting ratios. In particular rings with different finesse based on MMIs with 50:50, 72:28, and 85:15 splitting ratios have been designed, fabricated and successfully tested. In-band ripples as low as 0.2 dB and extinction ratios exceeding 15 dB have been measured from the fabricated samples. Repeatability of the performances from chip to chip and wafer to wafer is presented to show the tolerance of the devices to fabrication errors. Even though these particular devices have been designed for TE polarization only, polarization insensitive designs can be also achieved. All designs are based on strip waveguides and compact Euler-bends, leading to footprints in the order of 700x300 µm2, also thanks to an optimized configuration. They can find applications as interleavers as such or as stages in cascades of N interleavers to achieve flat-top 1x2N (de)multiplexers.

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KW - flat-top filters

KW - integrated optics

KW - multimode interference splitters

KW - photonic integrated circuits

KW - ring resonators

KW - silicon photonics

KW - WDM filters

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Cherchi M, Sun F, Kapulainen M, Vehmas T, Harjanne M, Aalto T. Fabrication tolerant flat-top interleavers. In Knights AP, Reed GT, editors, Silicon Photonics XII. International Society for Optics and Photonics SPIE. 2017. 101080V. (Proceedings of SPIE, Vol. 10108). https://doi.org/10.1117/12.2252110