Failure mechanism of Ta diffusion barrier between Cu and Si

Tomi Laurila, Kejun Zeng, Jorma Kivilahti, Jyrki Molarius, Ilkka Suni

Research output: Contribution to journalArticleScientificpeer-review

83 Citations (Scopus)

Fingerprint Dive into the research topics of 'Failure mechanism of Ta diffusion barrier between Cu and Si'. Together they form a unique fingerprint.

Physics & Astronomy