Feature Estimation for Punching Tool Wear at the Edge

Jukka Junttila*, Kalle Raunio, Petteri Kokkonen, Olli Saarela

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    As a fast and inexpensive machining method applicable for creating a wide range of shapes and producing large batches, sheet metal punching is widely used e.g., in automotive, aerospace, electronics, and construction industries. A significant downside of sheet metal punching is the punching tool wear in use. A worn punch tool may impact the quality of the end product by causing imperfections and reduce the efficiency of the manufacturing process through increased scrap and by slowing down the production. Effective monitoring of punching tool wear is therefore essential for an efficient and cost-effective production of high-quality parts. The monitoring can be based on acceleration measurement which produces large amounts of raw data, making edge processing ideal as only the indication of the tool condition needs to be sent forward for decision support. Classification models for tool wear identification were built and compared in this study. The models are based on measured acceleration data. Two different open-source methods for time series feature extraction, namely TSFEL and MiniRocket, were tested and the classification results based on them compared. All methods used for building the models are computationally light and therefore applicable for real-time data processing at the edge. According to the results the MiniRocket algorithm is suitable for the task and superior compared to the TSFEL method. The classification accuracies based on the MiniRocket features are at best over 96.5 % and at worst around 84 %, whereas the corresponding accuracies are between 35 and 56 % for TSFEL feature based models. The use of the MiniRocket algorithm in building a model for punch tool monitoring shows very promising results. However, the dataset used was very limited. Therefore, further investigation is required based on an ampler dataset.

    Original languageEnglish
    Title of host publicationProceedings of 3rd Eclipse Security, AI, Architecture and Modelling Conference on Cloud to Edge Continuum, eSAAM 2023
    PublisherAssociation for Computing Machinery ACM
    Pages86-89
    Number of pages4
    ISBN (Electronic)979-8-4007-0835-0
    DOIs
    Publication statusPublished - 17 Oct 2023
    MoE publication typeA4 Article in a conference publication
    Event3rd Eclipse Security, AI, Architecture and Modelling Conference on Cloud to Edge Continuum, eSAAM 2023, co-located with EclipseCon 2023 - Ludwigsburg, Germany
    Duration: 17 Oct 2023 → …

    Conference

    Conference3rd Eclipse Security, AI, Architecture and Modelling Conference on Cloud to Edge Continuum, eSAAM 2023, co-located with EclipseCon 2023
    Country/TerritoryGermany
    CityLudwigsburg
    Period17/10/23 → …

    Funding

    This work was labelled by ITEA3 and funded by local authorities under grant agreement “ITEA-2019-18022-IVVES”. Website of the project: https://ivves.eu.

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