Flip-Chip joining utilizing gold stud bumps

Tuomo Jaakola, Jaakko Lenkkeri, Jouko Vähäkangas

Research output: Contribution to journalArticleProfessional

Original languageEnglish
Pages (from-to)63-66
JournalFuture Circuits International
Publication statusPublished - 1998
MoE publication typeNot Eligible

Cite this

Jaakola, T., Lenkkeri, J., & Vähäkangas, J. (1998). Flip-Chip joining utilizing gold stud bumps. Future Circuits International, 63-66.