| Original language | English |
|---|---|
| Pages (from-to) | 63-66 |
| Journal | Future Circuits International |
| Publication status | Published - 1998 |
| MoE publication type | Not Eligible |
Flip-Chip joining utilizing gold stud bumps
Tuomo Jaakola, Jaakko Lenkkeri, Jouko Vähäkangas
Research output: Contribution to journal › Article › Professional