Flip-Chip joining utilizing gold stud bumps

Tuomo Jaakola, Jaakko Lenkkeri, Jouko Vähäkangas

Research output: Contribution to journalArticleProfessional

Original languageEnglish
Pages (from-to)63-66
JournalFuture Circuits International
Publication statusPublished - 1998
MoE publication typeNot Eligible

Cite this

Jaakola, T., Lenkkeri, J., & Vähäkangas, J. (1998). Flip-Chip joining utilizing gold stud bumps. Future Circuits International, 63-66.
Jaakola, Tuomo ; Lenkkeri, Jaakko ; Vähäkangas, Jouko. / Flip-Chip joining utilizing gold stud bumps. In: Future Circuits International. 1998 ; pp. 63-66.
@article{a93164346c3344a8abf45fb2753ed364,
title = "Flip-Chip joining utilizing gold stud bumps",
author = "Tuomo Jaakola and Jaakko Lenkkeri and Jouko V{\"a}h{\"a}kangas",
year = "1998",
language = "English",
pages = "63--66",
journal = "Future Circuits International",

}

Jaakola, T, Lenkkeri, J & Vähäkangas, J 1998, 'Flip-Chip joining utilizing gold stud bumps', Future Circuits International, pp. 63-66.

Flip-Chip joining utilizing gold stud bumps. / Jaakola, Tuomo; Lenkkeri, Jaakko; Vähäkangas, Jouko.

In: Future Circuits International, 1998, p. 63-66.

Research output: Contribution to journalArticleProfessional

TY - JOUR

T1 - Flip-Chip joining utilizing gold stud bumps

AU - Jaakola, Tuomo

AU - Lenkkeri, Jaakko

AU - Vähäkangas, Jouko

PY - 1998

Y1 - 1998

M3 - Article

SP - 63

EP - 66

JO - Future Circuits International

JF - Future Circuits International

ER -

Jaakola T, Lenkkeri J, Vähäkangas J. Flip-Chip joining utilizing gold stud bumps. Future Circuits International. 1998;63-66.