Paper industry is looking for opportunities to generate new business solutions and finding ways to improve its resource-efficiency. Traditionally foam is considered to cause problems in paper mills. However, foam assisted forming technology introduces new exciting opportunities for paper industry. During recent years, research at VTT Technical Research Centre of Finland has shown that foam could bring significant benefits for paper and board manufacturers. Foam assisted forming technology introduces new exciting opportunities to develop also totally new types of sustainable wood fibre products. The technology allows highly porous and thick structures to be produced from fibres. This enables exploitation of new raw material combinations extending the raw material base. Porous fibre structures can be made of any fibre or fibrous particle blends that possess adequate level of bonding or adhesion in wet and dry state. Several promising laboratory results encouraged VTT Technical Research Centre of Finland to rebuilt its pilot scale papermaking research environment to world’s first pilot scale foam forming environment together with several companies. This presentation gives an overview on the status of foam forming technology and discusses what was required to turn our existing pilot line to a foam forming environment. This presentation shows how the foam technologies can offer a sustainable alternative for companies to either improve their current competitiveness or even develop products for new market sectors.
|Publication status||Published - 2017|
|MoE publication type||Not Eligible|
|Event||China International Paper Technology Exhibition and Conference, CIPTE - Shenzhen, China|
Duration: 13 Sep 2017 → 15 Sep 2017
|Conference||China International Paper Technology Exhibition and Conference, CIPTE|
|Period||13/09/17 → 15/09/17|
Pääkkönen, E., Koponen, A., & Kiiskinen, H. (2017). Foam forming technology enables new possibilities for paper industry. Abstract from China International Paper Technology Exhibition and Conference, CIPTE, Shenzhen, China.