Foundations of Data Quality Assurance for IoT-based Smart Applications

Rodrigo Tognieri, Glauber Camponogara, Juha-Pekka Soininen, Carlos Kamienski

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    Most current scientific and industrial efforts in IoT are geared towards building integrated platforms to finally realize its potential in commercial scale applications. The IoT and Big Data contemporary context brings a number of challenges, such as providing quality assurance (defined by availability and
    veracity) for sensor data. Traditional signal processing approaches are no longer sufficient, requiring combined approaches in both architectural and analytical layers. This paper proposes a discussion on the adequate foundations of a new
    general approach aimed at increasing robustness and antifragility of IoT-based smart applications. In addition, it shows results of preliminary experiments with real data in the context of precision irrigation using multivariate methods to
    identify relevant situations, such as sensor failures and the mismatch of contextual sensor information due to different spatial granularities capture. Our results provide initial indications of the adequacy of the proposed framework.
    Original languageEnglish
    Title of host publicationIEEE LATINCOM 2019 Conference Proceedings
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Number of pages6
    Publication statusAccepted/In press - 13 Nov 2019
    MoE publication typeA4 Article in a conference publication
    EventIEEE Latin-American Conference on Communications - Salvador, Brazil
    Duration: 11 Nov 201913 Nov 2019

    Conference

    ConferenceIEEE Latin-American Conference on Communications
    CountryBrazil
    CitySalvador
    Period11/11/1913/11/19

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    Cite this

    Tognieri, R., Camponogara, G., Soininen, J-P., & Kamienski, C. (Accepted/In press). Foundations of Data Quality Assurance for IoT-based Smart Applications. In IEEE LATINCOM 2019 Conference Proceedings IEEE Institute of Electrical and Electronic Engineers .