Abstract
The fracture strength of Al2O3 membranes deposited by
atomic layer deposition at 110, 150, 200, and 300°C was
investigated. The fracture strength was found to be in
the range of 2.25-3.00GPa using Weibull statistics and
nearly constant as a function of deposition temperature.
This strength is superior to common
microelectromechanical systems materials such as
diamondlike carbon, SiO2, or SiC. As-deposited membranes
sustained high cycling pressure loads >10 bar/s without
fracture. Films featured, however, significant reduction
in the resistance to failure after annealing (800°C) or
high humidity (95%, 60°C) treatments
Original language | English |
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Article number | 01A106 |
Journal | Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films |
Volume | 33 |
Issue number | 1 |
Early online date | 25 Aug 2014 |
DOIs | |
Publication status | Published - 2015 |
MoE publication type | A1 Journal article-refereed |
Keywords
- atomic layer deposition
- ALD
- A12O3
- aluminum oxide
- fracture strength