Abstract
The fracture strength of Al2O3 membranes deposited by
atomic layer deposition at 110, 150, 200, and 300°C was
investigated. The fracture strength was found to be in
the range of 2.25-3.00GPa using Weibull statistics and
nearly constant as a function of deposition temperature.
This strength is superior to common
microelectromechanical systems materials such as
diamondlike carbon, SiO2, or SiC. As-deposited membranes
sustained high cycling pressure loads >10 bar/s without
fracture. Films featured, however, significant reduction
in the resistance to failure after annealing (800°C) or
high humidity (95%, 60°C) treatments
| Original language | English |
|---|---|
| Article number | 01A106 |
| Journal | Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films |
| Volume | 33 |
| Issue number | 1 |
| Early online date | 25 Aug 2014 |
| DOIs | |
| Publication status | Published - 2015 |
| MoE publication type | A1 Journal article-refereed |
Keywords
- atomic layer deposition
- ALD
- A12O3
- aluminum oxide
- fracture strength