From Y-chart to seamless integration of application design and performance simulation

Subayal Khan, Eila Ovaska, Kari Tiensyrjä, J. Nurmi

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)

Abstract

Performance simulation techniques play a key role in the architectural exploration phase of embedded systems design. Modern mobile devices support diverse applications that are enabled by rapid increase of computational power of mobile platforms. A brisk performance evaluation phase is required after the application modelling to evaluate feasibility of new applications on a platform. To reduce the modeling effort in performance simulation and to reduce time to market, the Application modeling and performance simulation phases must be seamlessly integrated. The landmark techniques in this area are developed around some key concepts which we explain first. Then we investigate each landmark contribution and mention the way each one of them addresses, extends and/or employs these key concepts. After mentioning the related work done in this area, we elaborate the methodology and tools which could be used as a potential solution to achieve the goal of seamless integration of application design and performance simulation. (27 refs.)
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publicationInternational Symposium on System-on-Chip, SOC 2010
EditorsJari Nurmi, Jarmo Takala, Olli Vainio, Perttu Salmela
Place of PublicationPiscataway, NJ, USA
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages18-25
ISBN (Electronic)978-1-4244-8278-8
ISBN (Print)978-1-4244-8279-5
DOIs
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication
EventInternational Symposium on System-on-Chip, SOC 2010 - Tampere, Finland
Duration: 29 Sep 201030 Sep 2010

Conference

ConferenceInternational Symposium on System-on-Chip, SOC 2010
Abbreviated titleSOC 2010
CountryFinland
CityTampere
Period29/09/1030/09/10

Fingerprint

Embedded systems
Mobile devices
Systems analysis

Cite this

Khan, S., Ovaska, E., Tiensyrjä, K., & Nurmi, J. (2010). From Y-chart to seamless integration of application design and performance simulation. In J. Nurmi, J. Takala, O. Vainio, & P. Salmela (Eds.), Proceedings: International Symposium on System-on-Chip, SOC 2010 (pp. 18-25). Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ISSOC.2010.5625563
Khan, Subayal ; Ovaska, Eila ; Tiensyrjä, Kari ; Nurmi, J. / From Y-chart to seamless integration of application design and performance simulation. Proceedings: International Symposium on System-on-Chip, SOC 2010. editor / Jari Nurmi ; Jarmo Takala ; Olli Vainio ; Perttu Salmela. Piscataway, NJ, USA : Institute of Electrical and Electronic Engineers IEEE, 2010. pp. 18-25
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Khan, S, Ovaska, E, Tiensyrjä, K & Nurmi, J 2010, From Y-chart to seamless integration of application design and performance simulation. in J Nurmi, J Takala, O Vainio & P Salmela (eds), Proceedings: International Symposium on System-on-Chip, SOC 2010. Institute of Electrical and Electronic Engineers IEEE, Piscataway, NJ, USA, pp. 18-25, International Symposium on System-on-Chip, SOC 2010, Tampere, Finland, 29/09/10. https://doi.org/10.1109/ISSOC.2010.5625563

From Y-chart to seamless integration of application design and performance simulation. / Khan, Subayal; Ovaska, Eila; Tiensyrjä, Kari; Nurmi, J.

Proceedings: International Symposium on System-on-Chip, SOC 2010. ed. / Jari Nurmi; Jarmo Takala; Olli Vainio; Perttu Salmela. Piscataway, NJ, USA : Institute of Electrical and Electronic Engineers IEEE, 2010. p. 18-25.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Khan S, Ovaska E, Tiensyrjä K, Nurmi J. From Y-chart to seamless integration of application design and performance simulation. In Nurmi J, Takala J, Vainio O, Salmela P, editors, Proceedings: International Symposium on System-on-Chip, SOC 2010. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE. 2010. p. 18-25 https://doi.org/10.1109/ISSOC.2010.5625563