Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Mikko Juntunen (Corresponding Author), Fan Ji, Kimmo Henttinen, Ismo Luusua, Iiro Hietanen, Simo Eränen

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Abstract

This paper presents a technology for a fully tileable two-dimensional (2D) photodiode matrix for medical imaging, specifically X-ray computed tomography (CT).
A key trend in the CT industry is to build machines with larger area detector to speed up the measurements and to avoid image blurring due to patient movement during scanning. In current CT detector constructions, a major limiting factor in providing more detector coverage is the need to read out the signals from the individual photo-detector elements of the detector array through lines along the surface facing the radiation source and wire bonds down to a substrate or to an electronics chip. Using this method, there is a physical limitation on the size of a photo-detector array that may be manufactured.
A photo-detector with the possibility of expansion in all directions is known as a ‘tileable’ detector. A technology of integrating through-wafer interconnects (TWIs) with traditional front illuminated photodiodes is introduced. Photocurrent can be read out from back side of the photodiode chip through interconnects, giving possibility of constructing arbitrarily large area of photo-detector for CT machine.
Results of a sample 2D demonstrator detector array are presented showing that the requirements of modern CT systems can be met.
Original languageEnglish
Pages (from-to)1000-1003
JournalNuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume580
Issue number2
DOIs
Publication statusPublished - 2007
MoE publication typeA1 Journal article-refereed

Fingerprint

Medical imaging
Photodiodes
photodiodes
wafers
Detectors
detectors
matrices
Tomography
tomography
chips (electronics)
blurring
radiation sources
Photocurrents
photocurrents
Electronic equipment
industries
chips
wire
Wire
Scanning

Keywords

  • computed tomography
  • tileability
  • through wafer interconnect

Cite this

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title = "Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects",
abstract = "This paper presents a technology for a fully tileable two-dimensional (2D) photodiode matrix for medical imaging, specifically X-ray computed tomography (CT). A key trend in the CT industry is to build machines with larger area detector to speed up the measurements and to avoid image blurring due to patient movement during scanning. In current CT detector constructions, a major limiting factor in providing more detector coverage is the need to read out the signals from the individual photo-detector elements of the detector array through lines along the surface facing the radiation source and wire bonds down to a substrate or to an electronics chip. Using this method, there is a physical limitation on the size of a photo-detector array that may be manufactured. A photo-detector with the possibility of expansion in all directions is known as a ‘tileable’ detector. A technology of integrating through-wafer interconnects (TWIs) with traditional front illuminated photodiodes is introduced. Photocurrent can be read out from back side of the photodiode chip through interconnects, giving possibility of constructing arbitrarily large area of photo-detector for CT machine. Results of a sample 2D demonstrator detector array are presented showing that the requirements of modern CT systems can be met.",
keywords = "computed tomography, tileability, through wafer interconnect",
author = "Mikko Juntunen and Fan Ji and Kimmo Henttinen and Ismo Luusua and Iiro Hietanen and Simo Er{\"a}nen",
year = "2007",
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volume = "580",
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journal = "Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment",
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Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects. / Juntunen, Mikko (Corresponding Author); Ji, Fan; Henttinen, Kimmo; Luusua, Ismo; Hietanen, Iiro; Eränen, Simo.

In: Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 580, No. 2, 2007, p. 1000-1003.

Research output: Contribution to journalArticleScientificpeer-review

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AU - Juntunen, Mikko

AU - Ji, Fan

AU - Henttinen, Kimmo

AU - Luusua, Ismo

AU - Hietanen, Iiro

AU - Eränen, Simo

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AB - This paper presents a technology for a fully tileable two-dimensional (2D) photodiode matrix for medical imaging, specifically X-ray computed tomography (CT). A key trend in the CT industry is to build machines with larger area detector to speed up the measurements and to avoid image blurring due to patient movement during scanning. In current CT detector constructions, a major limiting factor in providing more detector coverage is the need to read out the signals from the individual photo-detector elements of the detector array through lines along the surface facing the radiation source and wire bonds down to a substrate or to an electronics chip. Using this method, there is a physical limitation on the size of a photo-detector array that may be manufactured. A photo-detector with the possibility of expansion in all directions is known as a ‘tileable’ detector. A technology of integrating through-wafer interconnects (TWIs) with traditional front illuminated photodiodes is introduced. Photocurrent can be read out from back side of the photodiode chip through interconnects, giving possibility of constructing arbitrarily large area of photo-detector for CT machine. Results of a sample 2D demonstrator detector array are presented showing that the requirements of modern CT systems can be met.

KW - computed tomography

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