Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Mikko Juntunen (Corresponding Author), Fan Ji, Kimmo Henttinen, Ismo Luusua, Iiro Hietanen, Simo Eränen

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)


This paper presents a technology for a fully tileable two-dimensional (2D) photodiode matrix for medical imaging, specifically X-ray computed tomography (CT). A key trend in the CT industry is to build machines with larger area detector to speed up the measurements and to avoid image blurring due to patient movement during scanning. In current CT detector constructions, a major limiting factor in providing more detector coverage is the need to read out the signals from the individual photo-detector elements of the detector array through lines along the surface facing the radiation source and wire bonds down to a substrate or to an electronics chip. Using this method, there is a physical limitation on the size of a photo-detector array that may be manufactured.
A photo-detector with the possibility of expansion in all directions is known as a ‘tileable’ detector. A technology of integrating through-wafer interconnects (TWIs) with traditional front illuminated photodiodes is introduced. Photocurrent can be read out from back side of the photodiode chip through interconnects, giving possibility of constructing arbitrarily large area of photo-detector for CT machine. Results of a sample 2D demonstrator detector array are presented showing that the requirements of modern CT systems can be met.
Original languageEnglish
Pages (from-to)1000-1003
JournalNuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Issue number2
Publication statusPublished - 2007
MoE publication typeA1 Journal article-refereed


  • computed tomography
  • tileability
  • through wafer interconnect


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