G-band distributed microelectromechanical components based on CMOS compatible fabrication

    Research output: Contribution to journalArticleScientificpeer-review

    18 Citations (Scopus)

    Abstract

    Microelectromechanical systems (MEMS) technology has been used for realizing G-band (140-220 GHz) distributed MEMS transmission line components. Novel dielectric-less MEMS components, as well as switched MEMS capacitors, have been fabricated with CMOS compatible surface micromachining, and experimental results are presented up to 220 GHz.
    Original languageEnglish
    Pages (from-to)720 - 728
    Number of pages9
    JournalIEEE Transactions on Microwave Theory and Techniques
    Volume56
    Issue number3
    DOIs
    Publication statusPublished - 2008
    MoE publication typeA1 Journal article-refereed

    Keywords

    • $G$-band
    • CMOS
    • RF MEMS
    • microelectromechanical systems
    • MEMS
    • varactor

    Fingerprint

    Dive into the research topics of 'G-band distributed microelectromechanical components based on CMOS compatible fabrication'. Together they form a unique fingerprint.

    Cite this