GaAs-SOI integration as a path to low-cost optical interconnects

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, M. Guina, K. Haring, J. Puustinen, V. Mikhrin

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)

Abstract

We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)
Original languageEnglish
Title of host publicationIntegrated Optics: Devices, Materials, and Technologies XV
EditorsJean-Emmanue Broquin
Place of PublicationUSA
PublisherInternational Society for Optics and Photonics SPIE
Number of pages8
ISBN (Print)978-0-8194-8478-9
DOIs
Publication statusPublished - 2011
MoE publication typeA4 Article in a conference publication
EventIntegrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
- San Francisco, CA, United States
Duration: 24 Jan 201126 Jan 2011

Publication series

NameProceedings of SPIE
PublisherSPIE
Volume7941

Conference

ConferenceIntegrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
CountryUnited States
CitySan Francisco, CA
Period24/01/1126/01/11

Fingerprint

optical interconnects
insulators
silicon
packaging
wavelengths
nitrides
optical communication
platforms
modules
chips
quantum dots
waveguides
bandwidth
energy

Cite this

Aalto, T., Harjanne, M., Kapulainen, M., Ylinen, S., Guina, M., Haring, K., ... Mikhrin, V. (2011). GaAs-SOI integration as a path to low-cost optical interconnects. In J-E. Broquin (Ed.), Integrated Optics: Devices, Materials, and Technologies XV [79410S] USA: International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 7941 https://doi.org/10.1117/12.874644
Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami ; Guina, M. ; Haring, K. ; Puustinen, J. ; Mikhrin, V. / GaAs-SOI integration as a path to low-cost optical interconnects. Integrated Optics: Devices, Materials, and Technologies XV. editor / Jean-Emmanue Broquin. USA : International Society for Optics and Photonics SPIE, 2011. (Proceedings of SPIE, Vol. 7941).
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abstract = "We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)",
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Aalto, T, Harjanne, M, Kapulainen, M, Ylinen, S, Guina, M, Haring, K, Puustinen, J & Mikhrin, V 2011, GaAs-SOI integration as a path to low-cost optical interconnects. in J-E Broquin (ed.), Integrated Optics: Devices, Materials, and Technologies XV., 79410S, International Society for Optics and Photonics SPIE, USA, Proceedings of SPIE, vol. 7941, Integrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
, San Francisco, CA, United States, 24/01/11. https://doi.org/10.1117/12.874644

GaAs-SOI integration as a path to low-cost optical interconnects. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami; Guina, M.; Haring, K.; Puustinen, J.; Mikhrin, V.

Integrated Optics: Devices, Materials, and Technologies XV. ed. / Jean-Emmanue Broquin. USA : International Society for Optics and Photonics SPIE, 2011. 79410S (Proceedings of SPIE, Vol. 7941).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AB - We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)

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Aalto T, Harjanne M, Kapulainen M, Ylinen S, Guina M, Haring K et al. GaAs-SOI integration as a path to low-cost optical interconnects. In Broquin J-E, editor, Integrated Optics: Devices, Materials, and Technologies XV. USA: International Society for Optics and Photonics SPIE. 2011. 79410S. (Proceedings of SPIE, Vol. 7941). https://doi.org/10.1117/12.874644