GaAs-SOI integration as a path to low-cost optical interconnects

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, M. Guina, K. Haring, J. Puustinen, V. Mikhrin

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    6 Citations (Scopus)


    We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)
    Original languageEnglish
    Title of host publicationIntegrated Optics: Devices, Materials, and Technologies XV
    EditorsJean-Emmanue Broquin
    Place of PublicationUSA
    PublisherInternational Society for Optics and Photonics SPIE
    Number of pages8
    ISBN (Print)978-0-8194-8478-9
    Publication statusPublished - 2011
    MoE publication typeA4 Article in a conference publication
    EventIntegrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
    - San Francisco, CA, United States
    Duration: 24 Jan 201126 Jan 2011

    Publication series

    SeriesProceedings of SPIE


    ConferenceIntegrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
    Country/TerritoryUnited States
    CitySan Francisco, CA


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