GaAs-SOI integration as a path to low-cost optical interconnects

Timo Aalto; Mikko Harjanne; Markku Kapulainen; Sami Ylinen; M. Guina; K. Haring; J. Puustinen; V. Mikhrin

doi:10.1117/12.874644

GaAs-SOI integration as a path to low-cost optical interconnects

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, M. Guina, K. Haring, J. Puustinen, V. Mikhrin

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

6 Citations (Scopus)

Abstract

We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)

Original language	English
Title of host publication	Integrated Optics: Devices, Materials, and Technologies XV
Editors	Jean-Emmanue Broquin
Place of Publication	USA
Publisher	International Society for Optics and Photonics SPIE
Number of pages	8
ISBN (Print)	978-0-8194-8478-9
DOIs	https://doi.org/10.1117/12.874644
Publication status	Published - 2011
MoE publication type	A4 Article in a conference publication
Event	Integrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO - San Francisco, CA, United States Duration: 24 Jan 2011 → 26 Jan 2011

Publication series

Series	Proceedings of SPIE
Volume	7941

Conference

Conference	Integrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
Country/Territory	United States
City	San Francisco, CA
Period	24/01/11 → 26/01/11

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10.1117/12.874644

Cite this

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title = "GaAs-SOI integration as a path to low-cost optical interconnects",

abstract = "We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)",

author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen and M. Guina and K. Haring and J. Puustinen and V. Mikhrin",

year = "2011",

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publisher = "International Society for Optics and Photonics SPIE",

editor = "Jean-Emmanue Broquin",

booktitle = "Integrated Optics: Devices, Materials, and Technologies XV",

address = "United States",

note = "Integrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO <br/> ; Conference date: 24-01-2011 Through 26-01-2011",

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Aalto, T , Harjanne, M , Kapulainen, M , Ylinen, S, Guina, M, Haring, K, Puustinen, J & Mikhrin, V 2011, GaAs-SOI integration as a path to low-cost optical interconnects. in J-E Broquin (ed.), Integrated Optics: Devices, Materials, and Technologies XV., 79410S, International Society for Optics and Photonics SPIE, USA, Proceedings of SPIE, vol. 7941, Integrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO
, San Francisco, CA, United States, 24/01/11. https://doi.org/10.1117/12.874644

GaAs-SOI integration as a path to low-cost optical interconnects. / Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku et al.
Integrated Optics: Devices, Materials, and Technologies XV. ed. / Jean-Emmanue Broquin. USA: International Society for Optics and Photonics SPIE, 2011. 79410S (Proceedings of SPIE, Vol. 7941).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - GaAs-SOI integration as a path to low-cost optical interconnects

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Ylinen, Sami

AU - Guina, M.

AU - Haring, K.

AU - Puustinen, J.

AU - Mikhrin, V.

PY - 2011

Y1 - 2011

N2 - We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)

AB - We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 µm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode). (20 refs.)

U2 - 10.1117/12.874644

DO - 10.1117/12.874644

M3 - Conference article in proceedings

SN - 978-0-8194-8478-9

T3 - Proceedings of SPIE

BT - Integrated Optics: Devices, Materials, and Technologies XV

A2 - Broquin, Jean-Emmanue

PB - International Society for Optics and Photonics SPIE

CY - USA

T2 - Integrated Optics: Devices, Materials, and Technologies XV. SPIE OPTO <br/>

Y2 - 24 January 2011 through 26 January 2011

ER -

GaAs-SOI integration as a path to low-cost optical interconnects

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