Abstract
The selection and preparation of the dielectric is
essential for graphene electronics and photonics.
Industrial DRAM devices rely on ZrO2/Al2O3/ZrO2
(ZAZ)-structures as capacitor dielectrics with 2.5 nm/1
nm/2.5 nm thickness. Thin Al2O3 in between the ZrO2 films
interrupts the grain boundary evolution through the film
which minimizes both the leakage current and the surface
roughness, but maintains the high effective dielectric
constant. This would be favorable combination also in
graphene devices. In addition, high-k dielectrics such as
HfO2 and ZrO2 are superior in screening the charged
impurities, although the low surface optical (SO) phonon
energies significantly limit the mobility in graphene
above cryogenic temperatures.
Original language | English |
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Title of host publication | BALD2014 Abstract book |
Publication status | Published - 2014 |
MoE publication type | Not Eligible |
Event | 12th International Baltic Conference on Atomic Layer Deposition, Baltic ALD 2014 - Helsinki, Finland Duration: 12 May 2014 → 13 May 2014 Conference number: 12 http://www.aldcoe.fi/bald2014/program.pdf (Program) http://www.aldcoe.fi/bald2014/posters.pdf (Posters) |
Conference
Conference | 12th International Baltic Conference on Atomic Layer Deposition, Baltic ALD 2014 |
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Abbreviated title | Baltic ALD 2014 |
Country/Territory | Finland |
City | Helsinki |
Period | 12/05/14 → 13/05/14 |
Other | Abstracts reviewed and published. |
Internet address |
Keywords
- graphene
- dielectric
- mobility