Hermetic diode laser transmitter module

Jyrki Ollila, Kari Kautio, Jouko Vähäkangas, Tapio Hannula, Harri Kopola, Jorma Oikarinen, Matti Sivonen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

8 Citations (Scopus)

Abstract

In very demanding optoelectronic sensor applications it is necessary to encapsulate semiconductor components hermetically in metal housings to ensure reliable operation of the sensor. In this paper we report on the development work to package a laser diode transmitter module for a time- off-light distance sensor application. The module consists of a lens, laser diode, electronic circuit and optomechanics. Specifications include high acceleration, -40....+75 degree(s)C temperature range, very low gas leakage and mass-production capability. We have applied solder glasses for sealing optical lenses and electrical leads hermetically into a metal case. The lens-metal case sealing has been made by using a special soldering glass preform preserving the optical quality of the lens. The metal housings are finally sealed in an inert atmosphere by welding. The assembly concept to retain excellent optical power and tight optical axis alignment specifications is described. The reliability of the laser modules manufactured has been extensively tested using different aging and environmental test procedures. Sealed packages achieve MIL- 883 standard requirements for gas leakage.
Original languageEnglish
Title of host publicationTesting, Packaging, Reliability, and Applications of Semiconductor Lasers IV
PublisherInternational Society for Optics and Photonics SPIE
Pages123-126
Number of pages4
DOIs
Publication statusPublished - 1999
MoE publication typeB3 Non-refereed article in conference proceedings

Publication series

SeriesProceedings of SPIE
Volume3626
ISSN0277-786X

Fingerprint Dive into the research topics of 'Hermetic diode laser transmitter module'. Together they form a unique fingerprint.

Cite this