Hermetic diode laser transmitter module

Jyrki Ollila, Kari Kautio, Jouko Vähäkangas, Tapio Hannula, Harri Kopola, Jorma Oikarinen, Matti Sivonen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    8 Citations (Scopus)

    Abstract

    In very demanding optoelectronic sensor applications it is necessary to encapsulate semiconductor components hermetically in metal housings to ensure reliable operation of the sensor. In this paper we report on the development work to package a laser diode transmitter module for a time- off-light distance sensor application. The module consists of a lens, laser diode, electronic circuit and optomechanics. Specifications include high acceleration, -40....+75 degree(s)C temperature range, very low gas leakage and mass-production capability. We have applied solder glasses for sealing optical lenses and electrical leads hermetically into a metal case. The lens-metal case sealing has been made by using a special soldering glass preform preserving the optical quality of the lens. The metal housings are finally sealed in an inert atmosphere by welding. The assembly concept to retain excellent optical power and tight optical axis alignment specifications is described. The reliability of the laser modules manufactured has been extensively tested using different aging and environmental test procedures. Sealed packages achieve MIL- 883 standard requirements for gas leakage.
    Original languageEnglish
    Title of host publicationTesting, Packaging, Reliability, and Applications of Semiconductor Lasers IV
    PublisherInternational Society for Optics and Photonics SPIE
    Pages123-126
    Number of pages4
    DOIs
    Publication statusPublished - 1999
    MoE publication typeB3 Non-refereed article in conference proceedings

    Publication series

    SeriesProceedings of SPIE
    Volume3626
    ISSN0277-786X

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