Hermetic packaging for millimetre wave applications

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)

Abstract

Radio applications are utilising ever increasing frequencies. There is a pressure on the development of both semiconductor processes and module integration. For module integration low temperature co-fired ceramic (LTCC) technology has currently widely been used in e.g. RF front-end modules for portable devices but during last years it has also been applied to microwave and millimetre wave modules. The system-in-package LTCC platform is a true 3D module technology. Some components or applications require hermetic packaging. Typically AuSn solder pre-forms have been utilised in this kind of cases. High melting temperature may reduce the reliability of e.g. RF MEMS switches and other components. Therefore, processes with lower melting temperature solders (<;200°C) could be beneficial. This article reviews the current trends in LTCC materials and processing needed for hermetic millimetre wave products. LTCC materials, including some special materials, available for high-frequency applications are reviewed. Some of the key issues in the substrate processing are also reviewed. The developments in the packaging (such as low-temperature bonding and sealing processes) will also be presented. Hermetic packages with low RF losses have been characterised up to about 90 GHz.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publicationEuropean Microelectronics and Packaging Conference, EMPC 2013
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages5
ISBN (Electronic)978-2-9527-4671-7
Publication statusPublished - 2013
MoE publication typeNot Eligible
EventEMPC 2013: European Microelectronics and Packaging Conference - Grenoble, France
Duration: 9 Sep 201312 Sep 2013

Conference

ConferenceEMPC 2013
CountryFrance
CityGrenoble
Period9/09/1312/09/13

Fingerprint

Millimeter waves
Packaging
Ceramic materials
Soldering alloys
Melting point
Temperature
Processing
MEMS
Microwaves
Switches
Semiconductor materials
Substrates

Cite this

Lahti, M., Kautio, K., Ollila, J., Vähä-Heikkilä, T., & Kaunisto, M. (2013). Hermetic packaging for millimetre wave applications. In Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 IEEE Institute of Electrical and Electronic Engineers .
Lahti, Markku ; Kautio, Kari ; Ollila, Jyrki ; Vähä-Heikkilä, Tauno ; Kaunisto, Mikko. / Hermetic packaging for millimetre wave applications. Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 . IEEE Institute of Electrical and Electronic Engineers , 2013.
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abstract = "Radio applications are utilising ever increasing frequencies. There is a pressure on the development of both semiconductor processes and module integration. For module integration low temperature co-fired ceramic (LTCC) technology has currently widely been used in e.g. RF front-end modules for portable devices but during last years it has also been applied to microwave and millimetre wave modules. The system-in-package LTCC platform is a true 3D module technology. Some components or applications require hermetic packaging. Typically AuSn solder pre-forms have been utilised in this kind of cases. High melting temperature may reduce the reliability of e.g. RF MEMS switches and other components. Therefore, processes with lower melting temperature solders (<;200°C) could be beneficial. This article reviews the current trends in LTCC materials and processing needed for hermetic millimetre wave products. LTCC materials, including some special materials, available for high-frequency applications are reviewed. Some of the key issues in the substrate processing are also reviewed. The developments in the packaging (such as low-temperature bonding and sealing processes) will also be presented. Hermetic packages with low RF losses have been characterised up to about 90 GHz.",
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Lahti, M, Kautio, K, Ollila, J, Vähä-Heikkilä, T & Kaunisto, M 2013, Hermetic packaging for millimetre wave applications. in Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 . IEEE Institute of Electrical and Electronic Engineers , EMPC 2013, Grenoble, France, 9/09/13.

Hermetic packaging for millimetre wave applications. / Lahti, Markku; Kautio, Kari; Ollila, Jyrki; Vähä-Heikkilä, Tauno; Kaunisto, Mikko.

Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 . IEEE Institute of Electrical and Electronic Engineers , 2013.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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T1 - Hermetic packaging for millimetre wave applications

AU - Lahti, Markku

AU - Kautio, Kari

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AU - Vähä-Heikkilä, Tauno

AU - Kaunisto, Mikko

PY - 2013

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N2 - Radio applications are utilising ever increasing frequencies. There is a pressure on the development of both semiconductor processes and module integration. For module integration low temperature co-fired ceramic (LTCC) technology has currently widely been used in e.g. RF front-end modules for portable devices but during last years it has also been applied to microwave and millimetre wave modules. The system-in-package LTCC platform is a true 3D module technology. Some components or applications require hermetic packaging. Typically AuSn solder pre-forms have been utilised in this kind of cases. High melting temperature may reduce the reliability of e.g. RF MEMS switches and other components. Therefore, processes with lower melting temperature solders (<;200°C) could be beneficial. This article reviews the current trends in LTCC materials and processing needed for hermetic millimetre wave products. LTCC materials, including some special materials, available for high-frequency applications are reviewed. Some of the key issues in the substrate processing are also reviewed. The developments in the packaging (such as low-temperature bonding and sealing processes) will also be presented. Hermetic packages with low RF losses have been characterised up to about 90 GHz.

AB - Radio applications are utilising ever increasing frequencies. There is a pressure on the development of both semiconductor processes and module integration. For module integration low temperature co-fired ceramic (LTCC) technology has currently widely been used in e.g. RF front-end modules for portable devices but during last years it has also been applied to microwave and millimetre wave modules. The system-in-package LTCC platform is a true 3D module technology. Some components or applications require hermetic packaging. Typically AuSn solder pre-forms have been utilised in this kind of cases. High melting temperature may reduce the reliability of e.g. RF MEMS switches and other components. Therefore, processes with lower melting temperature solders (<;200°C) could be beneficial. This article reviews the current trends in LTCC materials and processing needed for hermetic millimetre wave products. LTCC materials, including some special materials, available for high-frequency applications are reviewed. Some of the key issues in the substrate processing are also reviewed. The developments in the packaging (such as low-temperature bonding and sealing processes) will also be presented. Hermetic packages with low RF losses have been characterised up to about 90 GHz.

M3 - Conference article in proceedings

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Lahti M, Kautio K, Ollila J, Vähä-Heikkilä T, Kaunisto M. Hermetic packaging for millimetre wave applications. In Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 . IEEE Institute of Electrical and Electronic Engineers . 2013