Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

K. Zoschke, C.-A. Manier, M. Wilke, N. Jürgensen, H. Oppermann, D. Ruffieux, James Dekker, Hannele Heikkinen, S. Dalla Piazza, G. Allegato, K.-D. Lang

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

    25 Citations (Scopus)

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