High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration: Dissertation

    Research output: ThesisDissertationMonograph

    Abstract

    Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.
    Original languageEnglish
    QualificationDoctor Degree
    Awarding Institution
    • University of Oulu
    Supervisors/Advisors
    • Myllylä, Risto, Supervisor, External person
    • Kopola, Harri, Supervisor
    Award date28 Nov 2008
    Place of PublicationEspoo
    Publisher
    Print ISBNs978-951-38-7127-7
    Electronic ISBNs978-951-38-7128-4
    Publication statusPublished - 2008
    MoE publication typeG4 Doctoral dissertation (monograph)

    Fingerprint

    Microoptics
    Optical interconnects
    Printed circuit boards
    Optical waveguides
    Transmitters
    Microlenses
    Optoelectronic devices
    Data communication systems
    Integrated circuits
    Lenses
    Mirrors
    Waveguides
    Electronic equipment
    Modulation
    Networks (circuits)
    Polymers
    Temperature

    Keywords

    • data transmission
    • optical interconnects
    • printed wiring boards
    • micro-optics
    • multi-channel optoelectronics
    • optical transmitters
    • optical receivers
    • optical waveguides
    • microlens arrays
    • micro-mirrors
    • LTCC
    • hybrid integration

    Cite this

    @phdthesis{f254afa431e444a4a8bb44ae3e048ed2,
    title = "High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration: Dissertation",
    abstract = "Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.",
    keywords = "data transmission, optical interconnects, printed wiring boards, micro-optics, multi-channel optoelectronics, optical transmitters, optical receivers, optical waveguides, microlens arrays, micro-mirrors, LTCC, hybrid integration",
    author = "Mikko Karppinen",
    year = "2008",
    language = "English",
    isbn = "978-951-38-7127-7",
    series = "VTT Publications",
    publisher = "VTT Technical Research Centre of Finland",
    number = "698",
    address = "Finland",
    school = "University of Oulu",

    }

    High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration : Dissertation. / Karppinen, Mikko.

    Espoo : VTT Technical Research Centre of Finland, 2008. 166 p.

    Research output: ThesisDissertationMonograph

    TY - THES

    T1 - High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration

    T2 - Dissertation

    AU - Karppinen, Mikko

    PY - 2008

    Y1 - 2008

    N2 - Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.

    AB - Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.

    KW - data transmission

    KW - optical interconnects

    KW - printed wiring boards

    KW - micro-optics

    KW - multi-channel optoelectronics

    KW - optical transmitters

    KW - optical receivers

    KW - optical waveguides

    KW - microlens arrays

    KW - micro-mirrors

    KW - LTCC

    KW - hybrid integration

    M3 - Dissertation

    SN - 978-951-38-7127-7

    T3 - VTT Publications

    PB - VTT Technical Research Centre of Finland

    CY - Espoo

    ER -