High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration

Dissertation

Research output: ThesisDissertationMonograph

Abstract

Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.
Original languageEnglish
QualificationDoctor Degree
Awarding Institution
  • University of Oulu
Supervisors/Advisors
  • Myllylä, Risto, Supervisor, External person
  • Kopola, Harri, Supervisor
Award date28 Nov 2008
Place of PublicationEspoo
Publisher
Print ISBNs978-951-38-7127-7
Electronic ISBNs978-951-38-7128-4
Publication statusPublished - 2008
MoE publication typeG4 Doctoral dissertation (monograph)

Fingerprint

Microoptics
Optical interconnects
Printed circuit boards
Optical waveguides
Transmitters
Microlenses
Optoelectronic devices
Data communication systems
Integrated circuits
Lenses
Mirrors
Waveguides
Electronic equipment
Modulation
Networks (circuits)
Polymers
Temperature

Keywords

  • data transmission
  • optical interconnects
  • printed wiring boards
  • micro-optics
  • multi-channel optoelectronics
  • optical transmitters
  • optical receivers
  • optical waveguides
  • microlens arrays
  • micro-mirrors
  • LTCC
  • hybrid integration

Cite this

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title = "High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration: Dissertation",
abstract = "Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.",
keywords = "data transmission, optical interconnects, printed wiring boards, micro-optics, multi-channel optoelectronics, optical transmitters, optical receivers, optical waveguides, microlens arrays, micro-mirrors, LTCC, hybrid integration",
author = "Mikko Karppinen",
year = "2008",
language = "English",
isbn = "978-951-38-7127-7",
series = "VTT Publications",
publisher = "VTT Technical Research Centre of Finland",
number = "698",
address = "Finland",
school = "University of Oulu",

}

High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration : Dissertation. / Karppinen, Mikko.

Espoo : VTT Technical Research Centre of Finland, 2008. 166 p.

Research output: ThesisDissertationMonograph

TY - THES

T1 - High bit-rate optical interconnects on printed wiring board. Micro-optics and hybrid integration

T2 - Dissertation

AU - Karppinen, Mikko

PY - 2008

Y1 - 2008

N2 - Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.

AB - Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects. The aim of the research work was to study and develop board-level optical interconnection technologies that would be suitable for volume manufacturing with typical electronics production processes, such as surface-mount assembly and board manufacturing. More precisely, the work focuses on the hybrid integration of multi-channel optoelectronics transmitters and receivers, which are equipped with micro-optical structures enabling coupling to board-embedded optical waveguides. The presented integration schemes are based on the use of low-temperature co fired ceramic (LTCC) circuit boards with high-precision alignment structures. Two experimental set-ups were designed and implemented to study the feasibility of the proposed integration schemes. The first set-up enabled evaluation of three different kinds of optical coupling schemes, which are based on microlenses, micro-ball lenses and butt-coupling respectively. The other demonstrator is a parallel optical interconnect integrated on a standard PWB. The optical coupling is based on microlens arrays and a micro-mirror, which, together with four polymer multimode waveguides on the PWB, form the interconnections between the surface-mounted 4-channel transmitter and receiver components. The optical performance of the demonstrated structures is studied by modelling and characterisation. With the proposed improvements, the presented technologies are suitable for implementation of high bit-rate interconnections between ceramic-packaged integrated circuits or multi-chip modules on PWB.

KW - data transmission

KW - optical interconnects

KW - printed wiring boards

KW - micro-optics

KW - multi-channel optoelectronics

KW - optical transmitters

KW - optical receivers

KW - optical waveguides

KW - microlens arrays

KW - micro-mirrors

KW - LTCC

KW - hybrid integration

M3 - Dissertation

SN - 978-951-38-7127-7

T3 - VTT Publications

PB - VTT Technical Research Centre of Finland

CY - Espoo

ER -