High density bump interconnections for flip chip hybridized pixel detectors

Jaakko Salonen, Jorma Salmi, Ilkka Suni

    Research output: Contribution to conferenceConference articleScientific

    Abstract

    A process is described for hybridization of detectors that will be used to build the inner Tracking System in Alice and, in modified form, the photoanode of the LHCb RICH detector at CERN.
    Original languageEnglish
    Publication statusPublished - 2002
    MoE publication typeNot Eligible
    Event4th International Workshop on Radiation Imaging Detectors, IWORID 2002 - Amsterdam, Netherlands
    Duration: 8 Sep 200212 Sep 2002
    Conference number: 4

    Conference

    Conference4th International Workshop on Radiation Imaging Detectors, IWORID 2002
    Abbreviated titleIWORID
    CountryNetherlands
    CityAmsterdam
    Period8/09/0212/09/02

    Keywords

    • pixel detectors
    • flip chip

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  • Cite this

    Salonen, J., Salmi, J., & Suni, I. (2002). High density bump interconnections for flip chip hybridized pixel detectors. Paper presented at 4th International Workshop on Radiation Imaging Detectors, IWORID 2002, Amsterdam, Netherlands.