High density R2R Screen Printed Silver Interconnections for Hybrid System Integration

Thomas Kraft, Lydia Leppänen, Terho Kololuoma, Sanna Lahokallio, Laura Frisk, Matti Mäntysalo

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm).
Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.
The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.
Original languageEnglish
Title of host publication6th Electronic System-Integration Technology Conference (ESTC)
PublisherInstitute of Electrical and Electronic Engineers IEEE
Number of pages6
ISBN (Electronic)978-1-5090-1402-6
ISBN (Print)978-1-5090-1403-3
DOIs
Publication statusPublished - 5 Dec 2016
MoE publication typeNot Eligible
Event6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France
Duration: 13 Sep 201616 Sep 2016
Conference number: 6

Conference

Conference6th Electronic System-Integration Technology Conference, ESTC 2016
Abbreviated titleESTC 2016
CountryFrance
CityGrenoble
Period13/09/1616/09/16

Fingerprint

Hybrid systems
Linewidth
Silver
Adhesives
Gold
Screen printing
Ink
Polyethylene terephthalates
Throughput
Nanoparticles

Keywords

  • adhesive joints
  • electronics packaging
  • flip chip devices
  • gold
  • gold metallography
  • hybrid systems
  • plastic bottles
  • screen printing
  • silver
  • studs

Cite this

Kraft, T., Leppänen, L., Kololuoma, T., Lahokallio, S., Frisk, L., & Mäntysalo, M. (2016). High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. In 6th Electronic System-Integration Technology Conference (ESTC) Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ESTC.2016.7764477
Kraft, Thomas ; Leppänen, Lydia ; Kololuoma, Terho ; Lahokallio, Sanna ; Frisk, Laura ; Mäntysalo, Matti. / High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. 6th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE, 2016.
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title = "High density R2R Screen Printed Silver Interconnections for Hybrid System Integration",
abstract = "In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm). Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.",
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Kraft, T, Leppänen, L, Kololuoma, T, Lahokallio, S, Frisk, L & Mäntysalo, M 2016, High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. in 6th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE, 6th Electronic System-Integration Technology Conference, ESTC 2016, Grenoble, France, 13/09/16. https://doi.org/10.1109/ESTC.2016.7764477

High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. / Kraft, Thomas; Leppänen, Lydia; Kololuoma, Terho; Lahokallio, Sanna; Frisk, Laura; Mäntysalo, Matti.

6th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Kraft, Thomas

AU - Leppänen, Lydia

AU - Kololuoma, Terho

AU - Lahokallio, Sanna

AU - Frisk, Laura

AU - Mäntysalo, Matti

PY - 2016/12/5

Y1 - 2016/12/5

N2 - In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm). Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.

AB - In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm). Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.

KW - adhesive joints

KW - electronics packaging

KW - flip chip devices

KW - gold

KW - gold metallography

KW - hybrid systems

KW - plastic bottles

KW - screen printing

KW - silver

KW - studs

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DO - 10.1109/ESTC.2016.7764477

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BT - 6th Electronic System-Integration Technology Conference (ESTC)

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Kraft T, Leppänen L, Kololuoma T, Lahokallio S, Frisk L, Mäntysalo M. High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. In 6th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE. 2016 https://doi.org/10.1109/ESTC.2016.7764477