High density R2R Screen Printed Silver Interconnections for Hybrid System Integration

Thomas Kraft, Lydia Leppänen, Terho Kololuoma, Sanna Lahokallio, Laura Frisk, Matti Mäntysalo

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm).
    Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.
    The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.
    Original languageEnglish
    Title of host publication6th Electronic System-Integration Technology Conference (ESTC)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Number of pages6
    ISBN (Electronic)978-1-5090-1402-6
    ISBN (Print)978-1-5090-1403-3
    DOIs
    Publication statusPublished - 5 Dec 2016
    MoE publication typeNot Eligible
    Event6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France
    Duration: 13 Sep 201616 Sep 2016
    Conference number: 6

    Conference

    Conference6th Electronic System-Integration Technology Conference, ESTC 2016
    Abbreviated titleESTC 2016
    CountryFrance
    CityGrenoble
    Period13/09/1616/09/16

    Keywords

    • adhesive joints
    • electronics packaging
    • flip chip devices
    • gold
    • gold metallography
    • hybrid systems
    • plastic bottles
    • screen printing
    • silver
    • studs

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