Abstract
This paper examines the utilization of plasma-enhanced atomic layer deposition grown AlN in the fabrication of a high-k insulator layer on GaAs. It is shown that high-k GaAs MIS capacitors with an unpinned Fermi level can be fabricated utilizing a thin ex-situ deposited AlN passivation layer. The illumination and temperature induced changes in the inversion side capacitance, and the maximum band bending of 1.2 eV indicates that the MIS capacitor reaches inversion. Removal of surface oxide is not required in contrast to many common ex-situ approaches.
| Original language | English |
|---|---|
| Article number | 071606 |
| Number of pages | 4 |
| Journal | Applied Physics Letters |
| Volume | 100 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2012 |
| MoE publication type | A1 Journal article-refereed |
Funding
The authors acknowledge the financial support from the Academy of Finland (Projects Nos. 12140711, 127689, and 128961).
Keywords
- Atomic layer deposition
- bending
- Fermi level
- gallium arsenide
- III-V semiconductors
- MIS capacitors
- passivation
- plasma deposition
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