High-performance vertical transition for broadband and millimetre-wave BGA module packaging

T. Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

    Research output: Contribution to journalArticle

    2 Citations (Scopus)

    Abstract

    A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated.
    Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.
    Original languageEnglish
    Pages (from-to)638-639
    JournalElectronics Letters
    Volume43
    Issue number11
    DOIs
    Publication statusPublished - 2007
    MoE publication typeA1 Journal article-refereed

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    Keywords

    • electronic systems
    • microelectronics Packaging
    • packaging
    • BGA
    • microwave devices
    • millimetre wave

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