High-performance vertical transition for broadband and millimetre-wave BGA module packaging

T. Kangasvieri; J. Halme; J. Vähäkangas; Markku Lahti

doi:10.1049/el:20070948

High-performance vertical transition for broadband and millimetre-wave BGA module packaging

T. Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

University of Oulu

Research output: Contribution to journal › Article › Scientific › peer-review

2 Citations (Scopus)

Abstract

A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated.
Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

Original language	English
Pages (from-to)	638-639
Journal	Electronics Letters
Volume	43
Issue number	11
DOIs	https://doi.org/10.1049/el:20070948
Publication status	Published - 2007
MoE publication type	A1 Journal article-refereed

Keywords

electronic systems
microelectronics Packaging
packaging
BGA
microwave devices
millimetre wave

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10.1049/el:20070948

Cite this

@article{d40ea3c7db634113beaea65df7d03cf3,

title = "High-performance vertical transition for broadband and millimetre-wave BGA module packaging",

abstract = "A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.",

keywords = "electronic systems, microelectronics Packaging, packaging, BGA, microwave devices, millimetre wave",

author = "T. Kangasvieri and J. Halme and J. V{\"a}h{\"a}kangas and Markku Lahti",

year = "2007",

doi = "10.1049/el:20070948",

language = "English",

volume = "43",

pages = "638--639",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "Institution of Engineering and Technology IET",

number = "11",

}

TY - JOUR

T1 - High-performance vertical transition for broadband and millimetre-wave BGA module packaging

AU - Kangasvieri, T.

AU - Halme, J.

AU - Vähäkangas, J.

AU - Lahti, Markku

PY - 2007

Y1 - 2007

N2 - A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

AB - A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

KW - electronic systems

KW - microelectronics Packaging

KW - packaging

KW - BGA

KW - microwave devices

KW - millimetre wave

U2 - 10.1049/el:20070948

DO - 10.1049/el:20070948

M3 - Article

SN - 0013-5194

VL - 43

SP - 638

EP - 639

JO - Electronics Letters

JF - Electronics Letters

IS - 11

ER -

High-performance vertical transition for broadband and millimetre-wave BGA module packaging

Abstract

Keywords

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