High-performance vertical transition for broadband and millimetre-wave BGA module packaging

T. Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

Research output: Contribution to journalArticleScientificpeer-review

2 Citations (Scopus)

Abstract

A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated.
Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.
Original languageEnglish
Pages (from-to)638-639
JournalElectronics Letters
Volume43
Issue number11
DOIs
Publication statusPublished - 2007
MoE publication typeA1 Journal article-refereed

Fingerprint

Ball grid arrays
Insertion losses
Millimeter waves
Electromagnetic waves
Packaging

Keywords

  • electronic systems
  • microelectronics Packaging
  • packaging
  • BGA
  • microwave devices
  • millimetre wave

Cite this

Kangasvieri, T. ; Halme, J. ; Vähäkangas, J. ; Lahti, Markku. / High-performance vertical transition for broadband and millimetre-wave BGA module packaging. In: Electronics Letters. 2007 ; Vol. 43, No. 11. pp. 638-639.
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High-performance vertical transition for broadband and millimetre-wave BGA module packaging. / Kangasvieri, T.; Halme, J.; Vähäkangas, J.; Lahti, Markku.

In: Electronics Letters, Vol. 43, No. 11, 2007, p. 638-639.

Research output: Contribution to journalArticleScientificpeer-review

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T1 - High-performance vertical transition for broadband and millimetre-wave BGA module packaging

AU - Kangasvieri, T.

AU - Halme, J.

AU - Vähäkangas, J.

AU - Lahti, Markku

PY - 2007

Y1 - 2007

N2 - A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

AB - A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

KW - electronic systems

KW - microelectronics Packaging

KW - packaging

KW - BGA

KW - microwave devices

KW - millimetre wave

U2 - 10.1049/el:20070948

DO - 10.1049/el:20070948

M3 - Article

VL - 43

SP - 638

EP - 639

JO - Electronics Letters

JF - Electronics Letters

SN - 0013-5194

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ER -