Abstract
A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated.
Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.
Measured results agreed well with full-wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.
| Original language | English |
|---|---|
| Pages (from-to) | 638-639 |
| Journal | Electronics Letters |
| Volume | 43 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 2007 |
| MoE publication type | A1 Journal article-refereed |
Keywords
- electronic systems
- microelectronics Packaging
- packaging
- BGA
- microwave devices
- millimetre wave
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