High-power module integrated in LTCC substrate

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publication4th European Microelectronics and Packaging Symposium
Pages155-158
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
Event4th European Microelectronics and Packaging Symposium - Terme Catez, Slovenia
Duration: 22 May 200624 May 2006
Conference number: 4

Conference

Conference4th European Microelectronics and Packaging Symposium
CountrySlovenia
CityTerme Catez
Period22/05/0624/05/06

Cite this

Lahti, M., Kautio, K., Juntunen, E., Petäjä, J., & Karioja, P. (2006). High-power module integrated in LTCC substrate. In 4th European Microelectronics and Packaging Symposium (pp. 155-158)
Lahti, Markku ; Kautio, Kari ; Juntunen, Eveliina ; Petäjä, Jarno ; Karioja, Pentti. / High-power module integrated in LTCC substrate. 4th European Microelectronics and Packaging Symposium. 2006. pp. 155-158
@inproceedings{2b5dbf7379fd466db805045c384e9639,
title = "High-power module integrated in LTCC substrate",
author = "Markku Lahti and Kari Kautio and Eveliina Juntunen and Jarno Pet{\"a}j{\"a} and Pentti Karioja",
year = "2006",
language = "English",
pages = "155--158",
booktitle = "4th European Microelectronics and Packaging Symposium",

}

Lahti, M, Kautio, K, Juntunen, E, Petäjä, J & Karioja, P 2006, High-power module integrated in LTCC substrate. in 4th European Microelectronics and Packaging Symposium. pp. 155-158, 4th European Microelectronics and Packaging Symposium, Terme Catez, Slovenia, 22/05/06.

High-power module integrated in LTCC substrate. / Lahti, Markku; Kautio, Kari; Juntunen, Eveliina; Petäjä, Jarno; Karioja, Pentti.

4th European Microelectronics and Packaging Symposium. 2006. p. 155-158.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - High-power module integrated in LTCC substrate

AU - Lahti, Markku

AU - Kautio, Kari

AU - Juntunen, Eveliina

AU - Petäjä, Jarno

AU - Karioja, Pentti

PY - 2006

Y1 - 2006

M3 - Conference article in proceedings

SP - 155

EP - 158

BT - 4th European Microelectronics and Packaging Symposium

ER -

Lahti M, Kautio K, Juntunen E, Petäjä J, Karioja P. High-power module integrated in LTCC substrate. In 4th European Microelectronics and Packaging Symposium. 2006. p. 155-158