High-power module integrated in LTCC substrate

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publication4th European Microelectronics and Packaging Symposium
Pages155-158
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
Event4th European Microelectronics and Packaging Symposium - Terme Catez, Slovenia
Duration: 22 May 200624 May 2006
Conference number: 4

Conference

Conference4th European Microelectronics and Packaging Symposium
CountrySlovenia
CityTerme Catez
Period22/05/0624/05/06

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