High-power module integrated in LTCC substrate

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Original languageEnglish
    Title of host publication4th European Microelectronics and Packaging Symposium
    Pages155-158
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication
    Event4th European Microelectronics and Packaging Symposium - Terme Catez, Slovenia
    Duration: 22 May 200624 May 2006
    Conference number: 4

    Conference

    Conference4th European Microelectronics and Packaging Symposium
    Country/TerritorySlovenia
    CityTerme Catez
    Period22/05/0624/05/06

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