High-power module integrated in LTCC substrate

Markku Lahti, Kari Kautio, Eveliina Juntunen, Jarno Petäjä, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	4th European Microelectronics and Packaging Symposium
Pages	155-158
Publication status	Published - 2006
MoE publication type	A4 Article in a conference publication
Event	4th European Microelectronics and Packaging Symposium - Terme Catez, Slovenia Duration: 22 May 2006 → 24 May 2006 Conference number: 4

Conference	4th European Microelectronics and Packaging Symposium
Country/Territory	Slovenia
City	Terme Catez
Period	22/05/06 → 24/05/06

Cite this

@inproceedings{2b5dbf7379fd466db805045c384e9639,

title = "High-power module integrated in LTCC substrate",

author = "Markku Lahti and Kari Kautio and Eveliina Juntunen and Jarno Pet{\"a}j{\"a} and Pentti Karioja",

year = "2006",

language = "English",

pages = "155--158",

booktitle = "4th European Microelectronics and Packaging Symposium",

note = "4th European Microelectronics and Packaging Symposium ; Conference date: 22-05-2006 Through 24-05-2006",

}

TY - GEN

T1 - High-power module integrated in LTCC substrate

AU - Lahti, Markku

AU - Kautio, Kari

AU - Juntunen, Eveliina

AU - Petäjä, Jarno

AU - Karioja, Pentti

N1 - Conference code: 4

PY - 2006

Y1 - 2006

M3 - Conference article in proceedings

SP - 155

EP - 158

BT - 4th European Microelectronics and Packaging Symposium

T2 - 4th European Microelectronics and Packaging Symposium

Y2 - 22 May 2006 through 24 May 2006

ER -