High speed micro welding of glass and silicon

V. Hautala, J. Vihinen, Päivi Heimala, Arto Nurmela, Jyrki Ollila

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Abstract

Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.
Original languageEnglish
Title of host publication14th NOLAMP Conference
Subtitle of host publicationThe 14th Nordic Laser Materials Processing Conference
PublisherLuleå University of Technology
Pages369-376
ISBN (Electronic)978-91-7439-689-8
ISBN (Print)978-91-7439-688-1
Publication statusPublished - 2013
MoE publication typeB3 Non-refereed article in conference proceedings
Event14th Nordic Laser Materials Processing Conference, NOLAMP 14 - Gothenburg, Sweden
Duration: 26 Aug 201328 Aug 2013
Conference number: 14

Conference

Conference14th Nordic Laser Materials Processing Conference, NOLAMP 14
Abbreviated titleNOLAMP 14
CountrySweden
CityGothenburg
Period26/08/1328/08/13

Fingerprint

Joining
Welding
Glass
Silicon
Lasers
Seam welding
Fiber lasers
Processing
Pulsed lasers
Integrated circuits
Packaging
Fusion reactions
Heating
Temperature

Keywords

  • silicon
  • glass
  • laser
  • welding

Cite this

Hautala, V., Vihinen, J., Heimala, P., Nurmela, A., & Ollila, J. (2013). High speed micro welding of glass and silicon. In 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference (pp. 369-376). Luleå University of Technology.
Hautala, V. ; Vihinen, J. ; Heimala, Päivi ; Nurmela, Arto ; Ollila, Jyrki. / High speed micro welding of glass and silicon. 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, 2013. pp. 369-376
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title = "High speed micro welding of glass and silicon",
abstract = "Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.",
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Hautala, V, Vihinen, J, Heimala, P, Nurmela, A & Ollila, J 2013, High speed micro welding of glass and silicon. in 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, pp. 369-376, 14th Nordic Laser Materials Processing Conference, NOLAMP 14, Gothenburg, Sweden, 26/08/13.

High speed micro welding of glass and silicon. / Hautala, V.; Vihinen, J.; Heimala, Päivi; Nurmela, Arto; Ollila, Jyrki.

14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, 2013. p. 369-376.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

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T1 - High speed micro welding of glass and silicon

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AU - Ollila, Jyrki

N1 - Project code: 73272

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N2 - Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

AB - Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

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Hautala V, Vihinen J, Heimala P, Nurmela A, Ollila J. High speed micro welding of glass and silicon. In 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology. 2013. p. 369-376