High speed micro welding of glass and silicon

V. Hautala; J. Vihinen; Päivi Heimala; Arto Nurmela; Jyrki Ollila

High speed micro welding of glass and silicon

V. Hautala, J. Vihinen, Päivi Heimala, Arto Nurmela, Jyrki Ollila

Tampere University of Technology (TUT)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

Original language	English
Title of host publication	14th NOLAMP Conference
Subtitle of host publication	The 14th Nordic Laser Materials Processing Conference
Editors	Alexander Kaplan, Hans Engström
Publisher	Luleå University of Technology
Pages	369-376
ISBN (Electronic)	978-91-7439-689-8
ISBN (Print)	978-91-7439-688-1
Publication status	Published - 2013
MoE publication type	A4 Article in a conference publication
Event	14th Nordic Laser Materials Processing Conference, NOLAMP 14 - Gothenburg, Sweden Duration: 26 Aug 2013 → 28 Aug 2013 Conference number: 14

Conference

Conference	14th Nordic Laser Materials Processing Conference, NOLAMP 14
Abbreviated title	NOLAMP 14
Country/Territory	Sweden
City	Gothenburg
Period	26/08/13 → 28/08/13

Keywords

silicon
glass
laser
welding

Access to Document

https://www.ltu.se/cms_fs/1.99082!/file/NOLAMP%2014%202013%20web.pdf#page=379

Cite this

@inproceedings{fa0a81f180764476b9d918110e7d11dd,

title = "High speed micro welding of glass and silicon",

abstract = "Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.",

keywords = "silicon, glass, laser, welding",

author = "V. Hautala and J. Vihinen and P{\"a}ivi Heimala and Arto Nurmela and Jyrki Ollila",

note = "Project code: 73272; 14th Nordic Laser Materials Processing Conference, NOLAMP 14, NOLAMP 14 ; Conference date: 26-08-2013 Through 28-08-2013",

year = "2013",

language = "English",

isbn = "978-91-7439-688-1",

pages = "369--376",

editor = "Alexander Kaplan and Hans Engstr{\"o}m",

booktitle = "14th NOLAMP Conference",

publisher = "Lule{\aa} University of Technology",

address = "Sweden",

}

Hautala, V, Vihinen, J, Heimala, P, Nurmela, A & Ollila, J 2013, High speed micro welding of glass and silicon. in A Kaplan & H Engström (eds), 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, pp. 369-376, 14th Nordic Laser Materials Processing Conference, NOLAMP 14, Gothenburg, Sweden, 26/08/13. <https://www.ltu.se/cms_fs/1.99082!/file/NOLAMP%2014%202013%20web.pdf#page=379>

High speed micro welding of glass and silicon. / Hautala, V.; Vihinen, J.; Heimala, Päivi et al.
14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . ed. / Alexander Kaplan; Hans Engström. Luleå University of Technology, 2013. p. 369-376.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - High speed micro welding of glass and silicon

AU - Hautala, V.

AU - Vihinen, J.

AU - Heimala, Päivi

AU - Nurmela, Arto

AU - Ollila, Jyrki

N1 - Conference code: 14

PY - 2013

Y1 - 2013

N2 - Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

AB - Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

KW - silicon

KW - glass

KW - laser

KW - welding

M3 - Conference article in proceedings

SN - 978-91-7439-688-1

SP - 369

EP - 376

BT - 14th NOLAMP Conference

A2 - Kaplan, Alexander

A2 - Engström, Hans

PB - Luleå University of Technology

T2 - 14th Nordic Laser Materials Processing Conference, NOLAMP 14

Y2 - 26 August 2013 through 28 August 2013

ER -

High speed micro welding of glass and silicon

Abstract

Conference

Keywords

Access to Document

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Cite this