High speed micro welding of glass and silicon

V. Hautala, J. Vihinen, Päivi Heimala, Arto Nurmela, Jyrki Ollila

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Abstract

    Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.
    Original languageEnglish
    Title of host publication14th NOLAMP Conference
    Subtitle of host publicationThe 14th Nordic Laser Materials Processing Conference
    PublisherLuleå University of Technology
    Pages369-376
    ISBN (Electronic)978-91-7439-689-8
    ISBN (Print)978-91-7439-688-1
    Publication statusPublished - 2013
    MoE publication typeB3 Non-refereed article in conference proceedings
    Event14th Nordic Laser Materials Processing Conference, NOLAMP 14 - Gothenburg, Sweden
    Duration: 26 Aug 201328 Aug 2013
    Conference number: 14

    Conference

    Conference14th Nordic Laser Materials Processing Conference, NOLAMP 14
    Abbreviated titleNOLAMP 14
    CountrySweden
    CityGothenburg
    Period26/08/1328/08/13

    Fingerprint

    Joining
    Welding
    Glass
    Silicon
    Lasers
    Seam welding
    Fiber lasers
    Processing
    Pulsed lasers
    Integrated circuits
    Packaging
    Fusion reactions
    Heating
    Temperature

    Keywords

    • silicon
    • glass
    • laser
    • welding

    Cite this

    Hautala, V., Vihinen, J., Heimala, P., Nurmela, A., & Ollila, J. (2013). High speed micro welding of glass and silicon. In 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference (pp. 369-376). Luleå University of Technology.
    Hautala, V. ; Vihinen, J. ; Heimala, Päivi ; Nurmela, Arto ; Ollila, Jyrki. / High speed micro welding of glass and silicon. 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, 2013. pp. 369-376
    @inproceedings{fa0a81f180764476b9d918110e7d11dd,
    title = "High speed micro welding of glass and silicon",
    abstract = "Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.",
    keywords = "silicon, glass, laser, welding",
    author = "V. Hautala and J. Vihinen and P{\"a}ivi Heimala and Arto Nurmela and Jyrki Ollila",
    note = "Project code: 73272",
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    Hautala, V, Vihinen, J, Heimala, P, Nurmela, A & Ollila, J 2013, High speed micro welding of glass and silicon. in 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, pp. 369-376, 14th Nordic Laser Materials Processing Conference, NOLAMP 14, Gothenburg, Sweden, 26/08/13.

    High speed micro welding of glass and silicon. / Hautala, V.; Vihinen, J.; Heimala, Päivi; Nurmela, Arto; Ollila, Jyrki.

    14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology, 2013. p. 369-376.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

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    AU - Heimala, Päivi

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    AU - Ollila, Jyrki

    N1 - Project code: 73272

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    N2 - Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

    AB - Joining of glass and silicon is often needed in integrated circuit packaging. Methods like anodic bonding and fusion bonding are used for joining silicon and glass wafers currently. Compared to these methods, laser joining can provide higher flexibility using easily defined bond regions that are fast to produce and only localized heating can be used. The whole wafer is not exposed to high temperature or electrical field in the laser joining, which is very important in certain applications. We were able to produce good quality welding seams that were less than 20 um wide. A picosecond pulsed fibre laser was used in tests and processing speeds from 100 mm/s to 2 m/s were tested. The high processing speed makes the laser joining a competitive method, as a whole wafer can be processed in sufficient time.

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    Hautala V, Vihinen J, Heimala P, Nurmela A, Ollila J. High speed micro welding of glass and silicon. In 14th NOLAMP Conference : The 14th Nordic Laser Materials Processing Conference . Luleå University of Technology. 2013. p. 369-376