Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper describes how the fictional concept of Holodeck can be seen as a new medium for future enacted immersive, narrative experiences. In essence the Holodeck can be understood as highly visual multisensory experience environment that can be employed for multiple purposes. The paper tackles the medium through the holonovel writing activity and pursues its design process by defining elements for science-fiction prototypes, i.e. short fictional stories. After introductory literature review, the paper presents important terminology for the holonovel design process, including the setup, important stakeholders (Holodeck characters), and those critical units and entities that are needed for defining the settings.
Original languageEnglish
Title of host publicationSpringer Innovations in Communication and Computing
Subtitle of host publicationEAI International Conference on Technology, Innovation, Entrepreneurship and Education, TIE 2017
EditorsPing Zheng, Callaghan Victor, Crawford David, Kymäläinen Tiina, Reyes-Munoz Angelica
PublisherSpringer
Pages55 - 65
ISBN (Electronic)978-3-030-16130-9
ISBN (Print)978-3-030-16129-3
DOIs
Publication statusPublished - 9 Jun 2019
MoE publication typeA4 Article in a conference publication
EventEAI International Conference on Technology, Innovation, Entrepreneurship and Education, Creative Science Foundation (CSf) Workshop - Canterbury, United Kingdom
Duration: 11 Sep 201712 Sep 2017

Conference

ConferenceEAI International Conference on Technology, Innovation, Entrepreneurship and Education, Creative Science Foundation (CSf) Workshop
CountryUnited Kingdom
CityCanterbury
Period11/09/1712/09/17

Fingerprint

Terminology

Keywords

  • Holodeck
  • Holonovel
  • Science-fiction prototype
  • Art education
  • 4D/AR/VR/MR experiences

Cite this

Kymäläinen, T. (2019). Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences. In P. Zheng, C. Victor, C. David, K. Tiina, & R-M. Angelica (Eds.), Springer Innovations in Communication and Computing: EAI International Conference on Technology, Innovation, Entrepreneurship and Education, TIE 2017 (pp. 55 - 65). Springer. https://doi.org/10.1007/978-3-030-16130-9_4
Kymäläinen, Tiina. / Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences. Springer Innovations in Communication and Computing: EAI International Conference on Technology, Innovation, Entrepreneurship and Education, TIE 2017. editor / Ping Zheng ; Callaghan Victor ; Crawford David ; Kymäläinen Tiina ; Reyes-Munoz Angelica. Springer, 2019. pp. 55 - 65
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title = "Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences",
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Kymäläinen, T 2019, Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences. in P Zheng, C Victor, C David, K Tiina & R-M Angelica (eds), Springer Innovations in Communication and Computing: EAI International Conference on Technology, Innovation, Entrepreneurship and Education, TIE 2017. Springer, pp. 55 - 65, EAI International Conference on Technology, Innovation, Entrepreneurship and Education, Creative Science Foundation (CSf) Workshop, Canterbury, United Kingdom, 11/09/17. https://doi.org/10.1007/978-3-030-16130-9_4

Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences. / Kymäläinen, Tiina.

Springer Innovations in Communication and Computing: EAI International Conference on Technology, Innovation, Entrepreneurship and Education, TIE 2017. ed. / Ping Zheng; Callaghan Victor; Crawford David; Kymäläinen Tiina; Reyes-Munoz Angelica. Springer, 2019. p. 55 - 65.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Kymäläinen T. Holodeck as a Medium for Future Enacted, Immersive, Narrative Experiences. In Zheng P, Victor C, David C, Tiina K, Angelica R-M, editors, Springer Innovations in Communication and Computing: EAI International Conference on Technology, Innovation, Entrepreneurship and Education, TIE 2017. Springer. 2019. p. 55 - 65 https://doi.org/10.1007/978-3-030-16130-9_4