Hot laminated multilayer polymer illumination structure based in embedded LED chips

Kimmo Keränen, Jukka-Tapani Mäkinen, Mikko Heikkinen, Marianne Hiltunen, Matti Koponen, Markku Lahti, Antti Sunnari, Kari Rönkä

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)

Abstract

The dominant technology for manufacturing backlight illumination structure (BLIS) is typically based on the use of individually packaged surface mount device light emitting diodes (LEDs) and special light guide plate (LGP) and diffuser films. The prevailing BLIS package, however, contains several separate diffuser films, which results in a thick and costly structure. In addition, the light coupling from LED to the LGP is sensitive to alignment errors causing nonuniform and inefficient illumination. We have demonstrated a novel hot laminated packaging structure for backlighting solutions, which is based on inorganic LED chips and multilayer polymer structure. The main advantages of the implemented system compared to the traditional light guiding system are easy optical coupling with high efficiency in an integrated and thin package. The performed designs of 3×3, 5×5, and 5×7 LED chip matrices, verified by test structure implementations and characterizations, showed that the final thickness of the BLIS depends on the required uniformity of illumination, allowed LED device pitch and efficiency of the diffuser. The final BLIS demonstrator size was 50×75 mm 2 consisting of six 25×25 mm 2 modules. Each module consisting 5×5 LED devices resulting in total number of 150 LED devices with 5-mm pitch. The measured key characteristics of the demonstrator were as follows: average brightness 11.600 cd/m 2 (ILED = 2 mA), luminous efficiency 22 lm/W, color temperature 5550 K, commission on illumination values (x = 0.331, y = 0.411), Color Rendering Index ≥ 70, and total power conversion efficiency of 6.3%. The combination of the developed Matlab performance simulation tool and cost-of-ownership cost evaluation tool enables us to estimate the manufacturing cost of a specific BLIS element against the required performance, assisting decision-making in different applications and specific individual customer cases.
Original languageEnglish
Pages (from-to)1965-1972
Number of pages7
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume2
Issue number12
DOIs
Publication statusPublished - 2012
MoE publication typeA1 Journal article-refereed

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Light emitting diodes
Polymers
Multilayers
Lighting
Color
Costs
Conversion efficiency
Luminance
Packaging
Decision making

Keywords

  • Illumination structure
  • inorganic LED chips
  • hot laminated
  • embedding
  • multilayer polymer substrate

Cite this

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title = "Hot laminated multilayer polymer illumination structure based in embedded LED chips",
abstract = "The dominant technology for manufacturing backlight illumination structure (BLIS) is typically based on the use of individually packaged surface mount device light emitting diodes (LEDs) and special light guide plate (LGP) and diffuser films. The prevailing BLIS package, however, contains several separate diffuser films, which results in a thick and costly structure. In addition, the light coupling from LED to the LGP is sensitive to alignment errors causing nonuniform and inefficient illumination. We have demonstrated a novel hot laminated packaging structure for backlighting solutions, which is based on inorganic LED chips and multilayer polymer structure. The main advantages of the implemented system compared to the traditional light guiding system are easy optical coupling with high efficiency in an integrated and thin package. The performed designs of 3×3, 5×5, and 5×7 LED chip matrices, verified by test structure implementations and characterizations, showed that the final thickness of the BLIS depends on the required uniformity of illumination, allowed LED device pitch and efficiency of the diffuser. The final BLIS demonstrator size was 50×75 mm 2 consisting of six 25×25 mm 2 modules. Each module consisting 5×5 LED devices resulting in total number of 150 LED devices with 5-mm pitch. The measured key characteristics of the demonstrator were as follows: average brightness 11.600 cd/m 2 (ILED = 2 mA), luminous efficiency 22 lm/W, color temperature 5550 K, commission on illumination values (x = 0.331, y = 0.411), Color Rendering Index ≥ 70, and total power conversion efficiency of 6.3{\%}. The combination of the developed Matlab performance simulation tool and cost-of-ownership cost evaluation tool enables us to estimate the manufacturing cost of a specific BLIS element against the required performance, assisting decision-making in different applications and specific individual customer cases.",
keywords = "Illumination structure, inorganic LED chips, hot laminated, embedding, multilayer polymer substrate",
author = "Kimmo Ker{\"a}nen and Jukka-Tapani M{\"a}kinen and Mikko Heikkinen and Marianne Hiltunen and Matti Koponen and Markku Lahti and Antti Sunnari and Kari R{\"o}nk{\"a}",
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language = "English",
volume = "2",
pages = "1965--1972",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
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Hot laminated multilayer polymer illumination structure based in embedded LED chips. / Keränen, Kimmo; Mäkinen, Jukka-Tapani; Heikkinen, Mikko; Hiltunen, Marianne; Koponen, Matti; Lahti, Markku; Sunnari, Antti; Rönkä, Kari.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 12, 2012, p. 1965-1972.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Hot laminated multilayer polymer illumination structure based in embedded LED chips

AU - Keränen, Kimmo

AU - Mäkinen, Jukka-Tapani

AU - Heikkinen, Mikko

AU - Hiltunen, Marianne

AU - Koponen, Matti

AU - Lahti, Markku

AU - Sunnari, Antti

AU - Rönkä, Kari

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AB - The dominant technology for manufacturing backlight illumination structure (BLIS) is typically based on the use of individually packaged surface mount device light emitting diodes (LEDs) and special light guide plate (LGP) and diffuser films. The prevailing BLIS package, however, contains several separate diffuser films, which results in a thick and costly structure. In addition, the light coupling from LED to the LGP is sensitive to alignment errors causing nonuniform and inefficient illumination. We have demonstrated a novel hot laminated packaging structure for backlighting solutions, which is based on inorganic LED chips and multilayer polymer structure. The main advantages of the implemented system compared to the traditional light guiding system are easy optical coupling with high efficiency in an integrated and thin package. The performed designs of 3×3, 5×5, and 5×7 LED chip matrices, verified by test structure implementations and characterizations, showed that the final thickness of the BLIS depends on the required uniformity of illumination, allowed LED device pitch and efficiency of the diffuser. The final BLIS demonstrator size was 50×75 mm 2 consisting of six 25×25 mm 2 modules. Each module consisting 5×5 LED devices resulting in total number of 150 LED devices with 5-mm pitch. The measured key characteristics of the demonstrator were as follows: average brightness 11.600 cd/m 2 (ILED = 2 mA), luminous efficiency 22 lm/W, color temperature 5550 K, commission on illumination values (x = 0.331, y = 0.411), Color Rendering Index ≥ 70, and total power conversion efficiency of 6.3%. The combination of the developed Matlab performance simulation tool and cost-of-ownership cost evaluation tool enables us to estimate the manufacturing cost of a specific BLIS element against the required performance, assisting decision-making in different applications and specific individual customer cases.

KW - Illumination structure

KW - inorganic LED chips

KW - hot laminated

KW - embedding

KW - multilayer polymer substrate

U2 - 10.1109/TCPMT.2012.2202231

DO - 10.1109/TCPMT.2012.2202231

M3 - Article

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SP - 1965

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 2156-3950

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ER -