How high-pressure die-cast component (HPDC) foundries benefit from numerical simulation

Eero Pellikka (Corresponding Author), Joachim Wendt

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)

Abstract

The value of simulating the high pressure die‐casting process is demonstrated by showing and discussing the abilities of state‐of‐the‐art modeling of a typical component of the electronics industry. Process parameters, which can be optimized by simulation as well as process improvements, are identified. An evaluation of HPDC‐modeling in terms of process improvement, quality, and efforts is carried out and prospects for future developments are given.
Original languageEnglish
Pages (from-to)58-61
JournalAdvanced Engineering Materials
Volume5
Issue number1-2
DOIs
Publication statusPublished - 2003
MoE publication typeA1 Journal article-refereed

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foundries
Electronics industry
Foundries
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Computer simulation
simulation
industries
evaluation
electronics

Keywords

  • diecasting
  • thermal stress simulation
  • tool design

Cite this

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title = "How high-pressure die-cast component (HPDC) foundries benefit from numerical simulation",
abstract = "The value of simulating the high pressure die‐casting process is demonstrated by showing and discussing the abilities of state‐of‐the‐art modeling of a typical component of the electronics industry. Process parameters, which can be optimized by simulation as well as process improvements, are identified. An evaluation of HPDC‐modeling in terms of process improvement, quality, and efforts is carried out and prospects for future developments are given.",
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How high-pressure die-cast component (HPDC) foundries benefit from numerical simulation. / Pellikka, Eero (Corresponding Author); Wendt, Joachim.

In: Advanced Engineering Materials, Vol. 5, No. 1-2, 2003, p. 58-61.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

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AU - Pellikka, Eero

AU - Wendt, Joachim

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AB - The value of simulating the high pressure die‐casting process is demonstrated by showing and discussing the abilities of state‐of‐the‐art modeling of a typical component of the electronics industry. Process parameters, which can be optimized by simulation as well as process improvements, are identified. An evaluation of HPDC‐modeling in terms of process improvement, quality, and efforts is carried out and prospects for future developments are given.

KW - diecasting

KW - thermal stress simulation

KW - tool design

U2 - 10.1002/adem.200390009

DO - 10.1002/adem.200390009

M3 - Article

VL - 5

SP - 58

EP - 61

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

SN - 1438-1656

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