The value of simulating the high pressure die‐casting process is demonstrated by showing and discussing the abilities of state‐of‐the‐art modeling of a typical component of the electronics industry. Process parameters, which can be optimized by simulation as well as process improvements, are identified. An evaluation of HPDC‐modeling in terms of process improvement, quality, and efforts is carried out and prospects for future developments are given.
- thermal stress simulation
- tool design