Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Teemu Alajoki, Matti Koponen, Markus Tuomikoski, M. Heikkinen, A. Keränen, Kimmo Keränen, J.-T. Mäkinen, Janne Aikio, Kari Rönkä

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

4 Citations (Scopus)

Abstract

Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.
Original languageEnglish
Title of host publication4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1-6
ISBN (Electronic)978-1-4673-4644-3, 978-1-4673-4643-6
ISBN (Print)978-1-4673-4645-0
DOIs
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication
Event4th Electronics system integration technologies conference, ESTC 2012 - Amsterdam, Netherlands
Duration: 17 Sep 201220 Sep 2012
Conference number: 4

Seminar

Seminar4th Electronics system integration technologies conference, ESTC 2012
Abbreviated titleESTC 2012
CountryNetherlands
CityAmsterdam
Period17/09/1220/09/12

Fingerprint

Plastic products
Automobile electronic equipment
Electronic medical equipment
Printed circuits
Consumer electronics
Organic light emitting diodes (OLED)
Polymer matrix
Injection molding
Optoelectronic devices
Metal foil
Electronic equipment
Sensors

Cite this

Alajoki, T., Koponen, M., Tuomikoski, M., Heikkinen, M., Keränen, A., Keränen, K., ... Rönkä, K. (2012). Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. In 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam (pp. 1-6). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ESTC.2012.6542129
Alajoki, Teemu ; Koponen, Matti ; Tuomikoski, Markus ; Heikkinen, M. ; Keränen, A. ; Keränen, Kimmo ; Mäkinen, J.-T. ; Aikio, Janne ; Rönkä, Kari. / Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers , 2012. pp. 1-6
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abstract = "Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.",
author = "Teemu Alajoki and Matti Koponen and Markus Tuomikoski and M. Heikkinen and A. Ker{\"a}nen and Kimmo Ker{\"a}nen and J.-T. M{\"a}kinen and Janne Aikio and Kari R{\"o}nk{\"a}",
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Alajoki, T, Koponen, M, Tuomikoski, M, Heikkinen, M, Keränen, A, Keränen, K, Mäkinen, J-T, Aikio, J & Rönkä, K 2012, Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. in 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers , pp. 1-6, 4th Electronics system integration technologies conference, ESTC 2012, Amsterdam, Netherlands, 17/09/12. https://doi.org/10.1109/ESTC.2012.6542129

Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. / Alajoki, Teemu; Koponen, Matti; Tuomikoski, Markus; Heikkinen, M.; Keränen, A.; Keränen, Kimmo; Mäkinen, J.-T.; Aikio, Janne; Rönkä, Kari.

4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers , 2012. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Alajoki, Teemu

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AU - Tuomikoski, Markus

AU - Heikkinen, M.

AU - Keränen, A.

AU - Keränen, Kimmo

AU - Mäkinen, J.-T.

AU - Aikio, Janne

AU - Rönkä, Kari

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N2 - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.

AB - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.

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Alajoki T, Koponen M, Tuomikoski M, Heikkinen M, Keränen A, Keränen K et al. Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. In 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers . 2012. p. 1-6 https://doi.org/10.1109/ESTC.2012.6542129