Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Teemu Alajoki; Matti Koponen; Markus Tuomikoski; M. Heikkinen; A. Keränen; Kimmo Keränen; Jukka-Tapani Mäkinen; Janne Aikio; Kari Rönkä

doi:10.1109/ESTC.2012.6542129

Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Teemu Alajoki, Matti Koponen, Markus Tuomikoski, M. Heikkinen, A. Keränen, Kimmo Keränen, Jukka-Tapani Mäkinen, Janne Aikio, Kari Rönkä

Tacto Tek Ltd

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

13 Citations (Scopus)

Abstract

Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.

Original language	English
Title of host publication	4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1-6
ISBN (Electronic)	978-1-4673-4644-3, 978-1-4673-4643-6
ISBN (Print)	978-1-4673-4645-0
DOIs	https://doi.org/10.1109/ESTC.2012.6542129
Publication status	Published - 2012
MoE publication type	A4 Article in a conference publication
Event	4th Electronics system integration technologies conference, ESTC 2012 - Amsterdam, Netherlands Duration: 17 Sept 2012 → 20 Sept 2012 Conference number: 4

Seminar

Seminar	4th Electronics system integration technologies conference, ESTC 2012
Abbreviated title	ESTC 2012
Country/Territory	Netherlands
City	Amsterdam
Period	17/09/12 → 20/09/12

Access to Document

10.1109/ESTC.2012.6542129

Cite this

Alajoki, T., Koponen, M., Tuomikoski, M., Heikkinen, M., Keränen, A., Keränen, K., Mäkinen, J-T., Aikio, J., & Rönkä, K. (2012). Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. In 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam (pp. 1-6). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ESTC.2012.6542129

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title = "Hybrid in-mould integration for novel electrical and optical features in 3D plastic products",

abstract = "Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.",

author = "Teemu Alajoki and Matti Koponen and Markus Tuomikoski and M. Heikkinen and A. Ker{\"a}nen and Kimmo Ker{\"a}nen and Jukka-Tapani M{\"a}kinen and Janne Aikio and Kari R{\"o}nk{\"a}",

year = "2012",

doi = "10.1109/ESTC.2012.6542129",

language = "English",

isbn = "978-1-4673-4645-0",

pages = "1--6",

booktitle = "4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "4th Electronics system integration technologies conference, ESTC 2012, ESTC 2012 ; Conference date: 17-09-2012 Through 20-09-2012",

}

Alajoki, T, Koponen, M, Tuomikoski, M, Heikkinen, M, Keränen, A, Keränen, K, Mäkinen, J-T, Aikio, J & Rönkä, K 2012, Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. in 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers, pp. 1-6, 4th Electronics system integration technologies conference, ESTC 2012, Amsterdam, Netherlands, 17/09/12. https://doi.org/10.1109/ESTC.2012.6542129

Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. / Alajoki, Teemu; Koponen, Matti; Tuomikoski, Markus et al.
4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers, 2012. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

AU - Alajoki, Teemu

AU - Koponen, Matti

AU - Tuomikoski, Markus

AU - Heikkinen, M.

AU - Keränen, A.

AU - Keränen, Kimmo

AU - Mäkinen, Jukka-Tapani

AU - Aikio, Janne

AU - Rönkä, Kari

N1 - Conference code: 4

PY - 2012

Y1 - 2012

N2 - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.

AB - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, hybrid in-mould integration of electronic and optoelectronic modules was exam-ined in order to embed novel functionality into polymer matrix. The feasibility to converge the printed electronics, component assembly and injection moulding manufacturing processes was examined by sim-ulations, experimental tests and by realizing three demonstrators: over-moulded optical touch panel, plas-tic embedded flexible organic light emitting diode (OLED) foil and disposable healthcare sensor with over-moulded flexible printed circuit (FPC) connector. The demonstrators proved that hybrid in-mould integration could be feasible technology enabling seamless integration of optical, electrical and mechanical features into 3D plastic products.

U2 - 10.1109/ESTC.2012.6542129

DO - 10.1109/ESTC.2012.6542129

M3 - Conference article in proceedings

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BT - 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 4th Electronics system integration technologies conference, ESTC 2012

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ER -

Alajoki T, Koponen M, Tuomikoski M, Heikkinen M, Keränen A, Keränen K et al. Hybrid in-mould integration for novel electrical and optical features in 3D plastic products. In 4th Electronics system integration technologies conference, ESTC 2012, 17 - 20 September 2012, Amsterdam. IEEE Institute of Electrical and Electronic Engineers. 2012. p. 1-6 doi: 10.1109/ESTC.2012.6542129

Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Abstract

Seminar

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