Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

Markku Kapulainen, Sami Ylinen, Timo Aalto, Mikko Harjanne, Kimmo Solehmainen, Jyrki Ollila, Ville Vilokkinen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

19 Citations (Scopus)

Abstract

Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
Original languageEnglish
Title of host publication5th IEEE International Conference on Group IV Photonics
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages61-63
ISBN (Electronic)978-1-4244-1768-1
ISBN (Print)978-1-4244-1769-8
DOIs
Publication statusPublished - 2008
MoE publication typeA4 Article in a conference publication
Event5th International Conference on Group IV Photonics - Sorrento, Italy
Duration: 17 Sep 2008 → 19 Sep 2008

Conference

Conference5th International Conference on Group IV Photonics
CountryItaly
CitySorrento
Period17/09/08 → 19/09/08

Keywords

  • Thermocompression
  • SOI waveguide
  • hybrid integration

Access to Document

Fingerprint Dive into the research topics of 'Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding'. Together they form a unique fingerprint.

    • Cite this

    Kapulainen, M., Ylinen, S., Aalto, T., Harjanne, M., Solehmainen, K., Ollila, J., & Vilokkinen, V. (2008). Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. In 5th IEEE International Conference on Group IV Photonics (pp. 61-63). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/GROUP4.2008.4638097