Abstract
Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has
been demonstrated. Good horizontal alignment is achieved by using active
alignment. Excellent passive vertical alignment is reached by using a easily
controlled fabrication process.
Original language | English |
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Title of host publication | 5th IEEE International Conference on Group IV Photonics |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 61-63 |
ISBN (Electronic) | 978-1-4244-1768-1 |
ISBN (Print) | 978-1-4244-1769-8 |
DOIs | |
Publication status | Published - 2008 |
MoE publication type | A4 Article in a conference publication |
Event | 5th International Conference on Group IV Photonics - Sorrento, Italy Duration: 17 Sep 2008 → 19 Sep 2008 |
Conference
Conference | 5th International Conference on Group IV Photonics |
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Country/Territory | Italy |
City | Sorrento |
Period | 17/09/08 → 19/09/08 |
Keywords
- Thermocompression
- SOI waveguide
- hybrid integration