Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

Markku Kapulainen, Sami Ylinen, Timo Aalto, Mikko Harjanne, Kimmo Solehmainen, Jyrki Ollila, Ville Vilokkinen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    26 Citations (Scopus)

    Abstract

    Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
    Original languageEnglish
    Title of host publication5th IEEE International Conference on Group IV Photonics
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages61-63
    ISBN (Electronic)978-1-4244-1768-1
    ISBN (Print)978-1-4244-1769-8
    DOIs
    Publication statusPublished - 2008
    MoE publication typeA4 Article in a conference publication
    Event5th International Conference on Group IV Photonics - Sorrento, Italy
    Duration: 17 Sept 200819 Sept 2008

    Conference

    Conference5th International Conference on Group IV Photonics
    Country/TerritoryItaly
    CitySorrento
    Period17/09/0819/09/08

    Keywords

    • Thermocompression
    • SOI waveguide
    • hybrid integration

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