Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

Markku Kapulainen, Sami Ylinen, Timo Aalto, Mikko Harjanne, Kimmo Solehmainen, Jyrki Ollila, Ville Vilokkinen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

19 Citations (Scopus)

Abstract

Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
Original languageEnglish
Title of host publication5th IEEE International Conference on Group IV Photonics
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages61-63
ISBN (Electronic)978-1-4244-1768-1
ISBN (Print)978-1-4244-1769-8
DOIs
Publication statusPublished - 2008
MoE publication typeA4 Article in a conference publication
Event5th International Conference on Group IV Photonics - Sorrento, Italy
Duration: 17 Sep 2008 → 19 Sep 2008

Conference

Conference5th International Conference on Group IV Photonics
CountryItaly
CitySorrento
Period17/09/08 → 19/09/08

Fingerprint

SOI (semiconductors)
alignment
waveguides
lasers
fabrication

Keywords

  • Thermocompression
  • SOI waveguide
  • hybrid integration

Cite this

Kapulainen, M., Ylinen, S., Aalto, T., Harjanne, M., Solehmainen, K., Ollila, J., & Vilokkinen, V. (2008). Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. In 5th IEEE International Conference on Group IV Photonics (pp. 61-63). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/GROUP4.2008.4638097
Kapulainen, Markku ; Ylinen, Sami ; Aalto, Timo ; Harjanne, Mikko ; Solehmainen, Kimmo ; Ollila, Jyrki ; Vilokkinen, Ville. / Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. 5th IEEE International Conference on Group IV Photonics. IEEE Institute of Electrical and Electronic Engineers , 2008. pp. 61-63
@inproceedings{2b7953a4b4854848879a48bed64222ea,
title = "Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding",
abstract = "Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.",
keywords = "Thermocompression, SOI waveguide, hybrid integration",
author = "Markku Kapulainen and Sami Ylinen and Timo Aalto and Mikko Harjanne and Kimmo Solehmainen and Jyrki Ollila and Ville Vilokkinen",
note = "CO:K Modulight, Tampere CA2: TK602",
year = "2008",
doi = "10.1109/GROUP4.2008.4638097",
language = "English",
isbn = "978-1-4244-1769-8",
pages = "61--63",
booktitle = "5th IEEE International Conference on Group IV Photonics",
publisher = "IEEE Institute of Electrical and Electronic Engineers",
address = "United States",

}

Kapulainen, M, Ylinen, S, Aalto, T, Harjanne, M, Solehmainen, K, Ollila, J & Vilokkinen, V 2008, Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. in 5th IEEE International Conference on Group IV Photonics. IEEE Institute of Electrical and Electronic Engineers , pp. 61-63, 5th International Conference on Group IV Photonics, Sorrento, Italy, 17/09/08. https://doi.org/10.1109/GROUP4.2008.4638097

Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. / Kapulainen, Markku; Ylinen, Sami; Aalto, Timo; Harjanne, Mikko; Solehmainen, Kimmo; Ollila, Jyrki; Vilokkinen, Ville.

5th IEEE International Conference on Group IV Photonics. IEEE Institute of Electrical and Electronic Engineers , 2008. p. 61-63.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

AU - Kapulainen, Markku

AU - Ylinen, Sami

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Solehmainen, Kimmo

AU - Ollila, Jyrki

AU - Vilokkinen, Ville

N1 - CO:K Modulight, Tampere CA2: TK602

PY - 2008

Y1 - 2008

N2 - Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.

AB - Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.

KW - Thermocompression

KW - SOI waveguide

KW - hybrid integration

U2 - 10.1109/GROUP4.2008.4638097

DO - 10.1109/GROUP4.2008.4638097

M3 - Conference article in proceedings

SN - 978-1-4244-1769-8

SP - 61

EP - 63

BT - 5th IEEE International Conference on Group IV Photonics

PB - IEEE Institute of Electrical and Electronic Engineers

ER -

Kapulainen M, Ylinen S, Aalto T, Harjanne M, Solehmainen K, Ollila J et al. Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. In 5th IEEE International Conference on Group IV Photonics. IEEE Institute of Electrical and Electronic Engineers . 2008. p. 61-63 https://doi.org/10.1109/GROUP4.2008.4638097

Access to Document