Abstract
| Original language | English |
|---|---|
| Title of host publication | 5th IEEE International Conference on Group IV Photonics |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 61-63 |
| ISBN (Electronic) | 978-1-4244-1768-1 |
| ISBN (Print) | 978-1-4244-1769-8 |
| DOIs | |
| Publication status | Published - 2008 |
| MoE publication type | A4 Article in a conference publication |
| Event | 5th International Conference on Group IV Photonics - Sorrento, Italy Duration: 17 Sep 2008 → 19 Sep 2008 |
Conference
| Conference | 5th International Conference on Group IV Photonics |
|---|---|
| Country | Italy |
| City | Sorrento |
| Period | 17/09/08 → 19/09/08 |
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Keywords
- Thermocompression
- SOI waveguide
- hybrid integration
Cite this
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Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding. / Kapulainen, Markku; Ylinen, Sami; Aalto, Timo; Harjanne, Mikko; Solehmainen, Kimmo; Ollila, Jyrki; Vilokkinen, Ville.
5th IEEE International Conference on Group IV Photonics. IEEE Institute of Electrical and Electronic Engineers , 2008. p. 61-63.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding
AU - Kapulainen, Markku
AU - Ylinen, Sami
AU - Aalto, Timo
AU - Harjanne, Mikko
AU - Solehmainen, Kimmo
AU - Ollila, Jyrki
AU - Vilokkinen, Ville
N1 - CO:K Modulight, Tampere CA2: TK602
PY - 2008
Y1 - 2008
N2 - Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
AB - Thermocompression bonding of InP lasers to 4µm thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
KW - Thermocompression
KW - SOI waveguide
KW - hybrid integration
U2 - 10.1109/GROUP4.2008.4638097
DO - 10.1109/GROUP4.2008.4638097
M3 - Conference article in proceedings
SN - 978-1-4244-1769-8
SP - 61
EP - 63
BT - 5th IEEE International Conference on Group IV Photonics
PB - IEEE Institute of Electrical and Electronic Engineers
ER -