@inproceedings{2e1acc72c1fa49158451b5e1630bfb19,
title = "Hybrid integration of InP photodetectors with SOI waveguides using thermocompression bonding",
abstract = "In this paper we present the integration of an InP-based photodetector with silicon-on-insulator (SOI) waveguides using thermocompression bonding. A BCB prism integrated on top of the light-sensitive area of a planar detector (PD) chip deflects the light from a 4 μm thick SOI waveguide upward into the flip-chip bonded PD. A trench is etched in front of the SOI waveguide to accommodate prisms with apexes up to 7 μm. Using thermocompression bonding between thin gold pads (~500 nm thickness) deposited on both, SOI and photodetector chips an excellent vertical alignment accuracy of ±100 nm can be achieved, limited only by etching and Au-deposition tolerances. A commercial flip-chip bonder provides a lateral alignment accuracy also in the sub-micron range. Together with a previously developed process for integrating lasers and SOA chips using the same technology, fully functional PICs can now be realized on the SOI platform using thermocompression bonding.",
keywords = "flip-chip, InP, integrated optics, photodetector, silicon-on-insulator, SOI, thermocompression bonding",
author = "Mikko Harjanne and Markku Kapulainen and Sami Ylinen and Timo Aalto and Jyrki Ollila and Ludwig M{\"o}rl and Wolfgang Passenberg",
note = "CO:U Fraunhofer-Institut f{\"u}r Nachrichtentechnik, Heinrich-Hertz-Institut, Germany CA2: TK610; Silicon Photonics and Photonic Integrated Circuits II ; Conference date: 12-04-2010 Through 16-04-2010",
year = "2010",
doi = "10.1117/12.854403",
language = "English",
isbn = "978-0-8194-8192-4",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Righini, {Giancarlo Cesare}",
booktitle = "Silicon Photonics and Photonic Integrated Circuits II",
address = "United States",
}